Author

Björn Senf

2014 · B. Senf, S. von Sachsen, et al. · Medical Engineering & Physics · 31
2025 · Lyazid Bouhala, Jérome Polesel, et al. · Composites Part C Open Access · 18
2021 · Thomas Mäder, Jonas v Heusinger, et al. · Journal of Intelligent Material Systems and Structures · 8
2017 · Thomas Mäder, Inaki Navarro y de Sosa, et al. · Key engineering materials · 5
2013 · S. von Sachsen, B. Senf, et al. · International Journal of Computer Assisted Radiology and Surgery · 2
2026 · Valentin Wilhelm Mauersberger, Björn Senf, et al. · Sensors · 1
2023 · Andreas Erben, Alexander Geist, et al. · Lecture notes in production engineering · 1
2014 · Christian Auerswald, Bjorn Senf, et al. · International Multi-Conference on Systems, Signals & Devices (SSD) · 1
2013 · Björn Senf, Christoph Eppler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
2012 · W.-G. Drossel, C. Ohsenbrügge, et al. · Biomedizinische Technik/Biomedical Engineering · 1
2011 · S. von Sachsen, F. W. Mohr, et al. · International Conference on Biomedical Engineering and Informatics (BMEI) · 1
2026 · Mauersberger, Valentin Wilhelm, Senf, Björn, et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft)
2026 · Alexander Hiekel, Björn Senf, et al. · EASN International Conference on Innovation in Aviation & Space Towards Sustainability Today & Tomorrow
2026 · Hiekel, Alexander, Senf, Björn, et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft)
2026 · Ray Saupe, Alexey Shaporin, et al. · China Semiconductor Technology International Conference (CSTIC)
Works count: 35
Citation count: 102
H-index: 6
I10-index: 3
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