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Shih‐Chi Yang

Ion-modulated radical doping of spiro-OMeTAD for more efficient and stable perovskite solar cells
2022 · Tiankai Zhang, Feng Wang, et al. · Science · 432
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Advanced Alkali Treatments for High‐Efficiency Cu(In,Ga)Se2 Solar Cells on Flexible Substrates
2019 · Romain Carron, Shiro Nishiwaki, et al. · Advanced Energy Materials · 244
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Efficiency boost of bifacial Cu(In,Ga)Se2 thin-film solar cells for flexible and tandem applications with silver-assisted low-temperature process
2022 · Shih-Chi Yang, Tzu-Ying Lin, et al. · Nature Energy · 131
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Mitigation of Vacuum and Illumination-Induced Degradation in Perovskite Solar Cells by Structure Engineering
2020 · Yan Jiang, Shih-Chi Yang, et al. · Joule · 119
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Degradation and self-repairing in perovskite light-emitting diodes
2021 · Pengpeng Teng, Sebastian Reichert, et al. · Matter · 91
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Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces
2022 · Jia-Juen Ong, Wei-Lan Chiu, et al. · Materials · 87
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A high performance 180 nm generation logic technology
2002 · S. Yang, S. Ahmed, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 87
MicroRNAs in the regulation of interfacial behaviors of MSCs cultured on microgrooved surface pattern
2011 · Yang Wang, Xian-Li Jiang, et al. · Biomaterials · 62
Silver‐Promoted High‐Performance (Ag,Cu)(In,Ga)Se2 Thin‐Film Solar Cells Grown at Very Low Temperature
2021 · Shih-Chi Yang, Jordi Sastre, et al. · Solar RRL · 57
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Passivation of positively charged cationic defects in perovskite with nitrogen-donor crown ether enabling efficient perovskite solar cells
2022 · Yuxuan Yang, Tao Zhao, et al. · Chemical Engineering Journal · 51
Triple-cation perovskite solar cells fabricated by a hybrid PVD/blade coating process using green solvents
2021 · Severin Siegrist, Shih-Chi Yang, et al. · Journal of Materials Chemistry A · 41
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Charge Carrier Lifetime Fluctuations and Performance Evaluation of Cu(In,Ga)Se2 Absorbers via Time‐Resolved‐Photoluminescence Microscopy
2021 · Mario Ochoa, Shih‐Chi Yang, et al. · Advanced Energy Materials · 34
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Influence of Ga back grading on voltage loss in low‐temperature co‐evaporated Cu(In,Ga)Se2 thin film solar cells
2021 · Shih‐Chi Yang, Mario Ochoa, et al. · Progress in Photovoltaics Research and Applications · 31
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Silver‐Alloyed Low‐Bandgap CuInSe 2 Solar Cells for Tandem Applications
2023 · Maximilian Krause, Shih-Chi Yang, et al. · Solar RRL · 29
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Periodic reverse electrodeposition of (1 1 1)-oriented nanotwinned Cu in small damascene SiO2 vias
2023 · Shih-Chi Yang, Dinh-Phuc Tran, et al. · Journal of Electroanalytical Chemistry · 24
Evolution of interfacial voids in Cu-to-Cu joints
2022 · Hung-Che Liu, Shih-Chi Yang, et al. · Materials Characterization · 21
To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
2023 · Yan-Rong Huang, Dinh-Phuc Tran, et al. · Journal of Materials Research and Technology · 20
Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu
2021 · Jia-Juen Ong, Dinh-Phuc Tran, et al. · Metals · 19
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Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
2023 · Wei-You Hsu, Shih-Chi Yang, et al. · Nanomaterials · 18
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Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures
2023 · Shih-Chi Yang, Dinh-Phuc Tran, et al. · Materials · 18
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Single-crystal-like Cu joints with high strength and resistance to fatigue failures
2022 · Jia-Juen Ong, Dinh-Phuc Tran, et al. · Materials Science and Engineering A · 18
Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect
2024 · Shih-Chi Yang, Yu-Tao Yang, et al. · Journal of Materials Research and Technology · 17
Low-Temperature Cu-Cu Bonding Using <111>-oriented and Nanocrystalline Hybrid Surface Grains
2024 · Chen-Ning Li, Jia-Juen Ong, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 17
In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density
2025 · Hua-Jing Huang, Chien-Hua Wang, et al. · ACS Nano · 14
Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing
2023 · Jyun-Yu Lai, Dinh-Phuc Tran, et al. · Nanomaterials · 12
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Works count: 45
Citation count: 1,811
H-index: 18
I10-index: 30
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