Author

Johan Le Leslé

Observed names: Johan LE LESLE, Johan Le Lesle, Le Lesle, Johan
ORCID: 0000-0002-6939-5878
Observed ORCID: 0000-0002-6939-5878
OpenAlex ID: A5001141585
2018 · Cyril Buttay, Christian Martin, et al. · International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) · 42
2018 · Remy Caillaud, Cyril Buttay, et al. · IEEE International Conference on Industrial Technology (ICIT) · 15
2019 · Remy Caillaud, Cyril Buttay, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 13
2017 · Remy Caillaud, Cyril Buttay, et al. · IEEE International Workshop on Integrated Power Packaging (IWIPP) · 13
2021 · Johan Le Lesle, Julien Morand, et al. · European Conference on Power Electronics and Applications · 11
2017 · Johan Le Lesle, Remy Caillaud, et al. · IEEE Energy Conversion Congress and Exposition (ECCE) · 10
2021 · Remi Perrin, Johan Le Lesle, et al. · European Conference on Power Electronics and Applications · 9
2019 · Rémy Caillaud, Johan Le Leslé, et al. · IEEE International Workshop on Integrated Power Packaging (IWIPP) · 9
2018 · Johan Le Lesle, Remy Caillaud, et al. · IEEE International Conference on Industrial Technology (ICIT) · 9
2023 · Pierre-Yves Pichon, Julio Brandelero, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 5
2017 · Caillaud, Rémy, Buttay, Cyril, et al. · HAL · 4
2019 · Johan LE LESLE, Corentin DARBAS, et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · 1
2018 · Rémy Caillaud, Johan Le Leslé, et al. · 1
2025 · Le Lesle, Johan, Lefèvre, Guillaume, et al. · HAL
2025 · Morand, Julien, Le Lesle, Johan, et al. · HAL
2022 · Julien Morand, Johan Le Lesle · IEEE International Workshop on Integrated Power Packaging (IWIPP)
Works count: 21
Citation count: 151
H-index: 9
I10-index: 6
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