Author

Y. T. Lui

Institutions: City University of Hong Kong, Kwame Nkrumah University of Science and Technology, University of Greenwich

Observed institutions: City University of Hong Kong, Kwame Nkrumah University of Science and Technology, University of Greenwich

OpenAlex ID: A5001365511

Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

2011 · E. H. Amalu, Y. T. Lui, et al. · AIP conference proceedings · 8

Works count: 1

Citation count: 8

H-index: 1

I10-index: