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Tushar Chauhan

ORCID: 0000-0002-8726-3473
Observed ORCID: 0000-0002-8726-3473
OpenAlex ID: A5001502109
Computational Analysis for Thermal Optimization of Server for Single Phase Immersion Cooling
2019 · Dhruvkumar Gandhi, Uschas Chowdhury, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 30
Experimental Analysis for Optimization of Thermal Performance of a Server in Single Phase Immersion Cooling
2019 · Pravin A. Shinde, Pratik V. Bansode, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 25
Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages
2019 · Shrinath Ramdas, Pavan Rajmane, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 18
CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid
2020 · Amirreza Niazmand, Tushar Chauhan, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 15
Impact of Immersion Cooling on Thermomechanical Properties of Low-loss Material Printed Circuit Boards
2021 · Tushar Chauhan, Rabin Bhandari, et al. · Enhanced heat transfer/Journal of enhanced heat transfer · 13
Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers
2019 · Abel Misrak, Tushar Chauhan, et al. · Journal of Electronic Packaging · 12
Impact of Die Attach Sample Preparation on Its Measured Mechanical Properties for MEMS Sensor Applications
2021 · Abel Misrak, Tushar Chauhan, et al. · Journal of Microelectronics and Electronic Packaging · 11
Systematic Reliability Study of a Large Size 2.5D Package with RDL Interposer for AI Processor
2026 · Richard Rao, Ivan Tan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node
2024 · Shrinath Shrinivas Ramdas, Tushar Chauhan, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1
Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliability of WCSP Packages Under Drop Test
2020 · Akshay Lakshminarayana, Abel Misrak, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Comparative Analysis of Soft Computing Techniques for Remnant Life Estimation of Power Transformers
2026 · Tushar Chauhan, Katam Nishanth · IEEE North-East India International Energy Conversion Conference and Exhibition (NE-IECCE)
Numerical Investigation of Package Design to Optimize Thermally Induced Stress in 2.5D Advanced FCBGA Package
2025 · Tushar Chauhan, Shrinath Ramdas, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Impact of Core Material Coefficient of Thermal Expansion (CTE) on Warpage Assessment of Larger FCBGA Package With Stiffener Ring
2025 · Shrinath Ramdas, Tushar Chauhan, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Works count: 13
Citation count: 127
H-index: 7
I10-index: 7
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