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Haochun Tang

Observed names: H TANG, H. Tang, H.-C. Tang, Hao-Chun TANG, Hao-Chun Tang, Tang Hao-Chun, Tang, Hao-Chun
Observed institutions: Northwestern University, University of Nebraska–Lincoln, Tokyo Institute of Technology, Chinese Academy of Sciences, Japan Science and Technology Agency, Changchun Institute of Applied Chemistry, National Defense University, Centre de Recherche en Économie et Statistique, Materials & Structures Laboratory
ORCID: 0000-0001-9258-6368
Observed ORCID: 0000-0001-9258-6368
OpenAlex ID: A5001834251
Dislocation escape-related size effects in single-crystal micropillars under uniaxial compression
2006 · H. Tang, K.W. Schwarz, et al. · Acta Materialia · 157
Dislocation-Source Shutdown and the Plastic Behavior of Single-Crystal Micropillars
2008 · H. Tang, K. W. Schwarz, et al. · Physical Review Letters · 143
An elasto-viscoplastic interface model for investigating the constitutive behavior of nacre
2007 · H TANG, F BARTHELAT, et al. · Journal of the Mechanics and Physics of Solids · 100
Multiple Roles of Hydrogen Treatments in Amorphous In–Ga–Zn–O Films
2017 · Haochun Tang, Yosuke Kishida, et al. · ECS Journal of Solid State Science and Technology · 42
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Effects of residual hydrogen in sputtering atmosphere on structures and properties of amorphous In-Ga-Zn-O thin films
2015 · Haochun Tang, Kyohei Ishikawa, et al. · Journal of Applied Physics · 41
Effects of thermal annealing on elimination of deep defects in amorphous In–Ga–Zn–O thin-film transistors
2016 · Haochun Tang, Keisuke Ide, et al. · Thin Solid Films · 21
Micro-bending testing of electrodeposited gold for applications as movable components in MEMS devices
2017 · Keisuke Asano, Hao-Chun Tang, et al. · Microelectronic Engineering · 18
Effects of Base Pressure on Growth and Optoelectronic Properties of Amorphous In‐Ga‐Zn‐O: Ultralow Optimum Oxygen Supply and Bandgap Widening
2018 · Keisuke Ide, Kyohei Ishikawa, et al. · physica status solidi (a) · 16
Au–Cu Alloys Prepared by Pulse Electrodeposition toward Applications as Movable Micro-Components in Electronic Devices
2018 · Haochun Tang, Chun-Yi Chen, et al. · Journal of The Electrochemical Society · 16
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Processing, microstructure and mechanical properties of WAl bulk alloy obtained by mechanical alloying and hot-pressing
2004 · C ZHU, X MA, et al. · Scripta Materialia · 15
Promoted bending strength in micro-cantilevers composed of nanograined gold toward MEMS applications
2018 · Keisuke Asano, Haochun Tang, et al. · Microelectronic Engineering · 13
High-Strength Electroplated Au–Cu Alloys as Micro-Components in MEMS Devices
2017 · Haochun Tang, Chun-Yi Chen, et al. · Journal of The Electrochemical Society · 13
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Sample size effect on micro-mechanical properties of gold electroplated with dense carbon dioxide
2018 · Haochun Tang, Ken Hashigata, et al. · Surface and Coatings Technology · 11
Enhancement of mechanical strength in Au films electroplated with supercritical carbon dioxide
2016 · Haochun Tang, Chun-Yi Chen, et al. · Electrochemistry Communications · 11
Nanoscale Hierarchical Structure of Twins in Nanograins Embedded with Twins and the Strengthening Effect
2019 · Haochun Tang, Tso-Fu Mark Chang, et al. · Metals · 10
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Strengthening of micro-cantilever by Au/Ti bi-layered structure evaluated by micro-bending test toward MEMS devices
2019 · Ken Hashigata, Tso-Fu Mark Chang, et al. · Microelectronic Engineering · 10
Superelastic behavior of single crystalline Ni48Fe20Co5Ga27 micro-pillars near austenite–martensite critical point
2021 · T.-F. M. Chang, V. Chernenko, et al. · AIP Advances · 6
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SYNTHESIS AND TRIBOLOGICAL PROPERTIES OF Ti-DOPED NbSe2 NANOPARTICLES
2014 · Q. Shi, Haochun Tang, et al. · 5
Alloy Electroplating and Young’s Modulus Characterization of AuCu Alloy Microcantilevers
2020 · Kyotaro Nitta, Tso-Fu Mark Chang, et al. · Journal of The Electrochemical Society · 4
Cu-alloying effect on structure stability of electrodeposited gold-based micro-cantilever evaluated by long-term vibration test
2019 · Kyotaro Nitta, Tso-Fu Mark Chang, et al. · Microelectronic Engineering · 3
High Strength Electrodeposited Au-Cu Alloys Evaluated by Bending Test toward Movable Micro-Components
2019 · Keisuke Asano, Tso-Fu Mark Chang, et al. · ECS Journal of Solid State Science and Technology · 3
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Fabrication and opto-electrical properties of amorphous (Zn,B)O thin film by pulsed laser deposition
2015 · Hao-Chun TANG, Junghwan KIM, et al. · Journal of the Ceramic Society of Japan · 3
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Pulse-Current Electrodeposition of Gold
2019 · Chun-Yi Chen, Masaharu Yoshiba, et al. · IntechOpen eBooks · 2
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Electrodeposition of Gold Alloys and the Mechanical Properties
2019 · Haochun Tang, Tso-Fu Mark Chang, et al. · IntechOpen eBooks · 2
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Thermal and thermo-mechanical simulations on high power diode packaging for a typical power adapter
2013 · Pei-Hsuan Wu, Zhong-Yi Wu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
Works count: 90
Citation count: 668
H-index: 12
I10-index: 16
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