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Liam Madden

Observed names: L. Madden, L.C. Madden
ORCID: 0000-0002-2814-276X
Observed ORCID: 0000-0002-2814-276X
OpenAlex ID: A5002455636
A 160-MHz, 32-b, 0.5-W CMOS RISC microprocessor
1996 · J. Montanaro, R.T. Witek, et al. · IEEE Journal of Solid-State Circuits · 635
A 200-MHz 64-b dual-issue CMOS microprocessor
1992 · D.W. Dobberpuhl, R.T. Witek, et al. · IEEE Journal of Solid-State Circuits · 387
A 160 MHz 32 b 0.5 W CMOS RISC microprocessor
2002 · J. Montanaro, R.T. Witek, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 118
Exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design
2001 · B. Kleveland, C.H. Diaz, et al. · IEEE Journal of Solid-State Circuits · 109
Monolithic CMOS distributed amplifier and oscillator
2003 · B. Kleveland, C.H. Diaz, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 94
A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters
2014 · Christophe Erdmann, Donnacha Lowney, et al. · IEEE Journal of Solid-State Circuits · 79
High-frequency characterization of on-chip digital interconnects
2002 · B. Kleveland, Xiaoning Qi, et al. · IEEE Journal of Solid-State Circuits · 76
A 160-MHz, 32-b, 0.5-W CMOS RISC microprocessor
1997 · J. Montanaro, Richard T. Witek, et al. · Digital technical journal · 75
Reliability evaluation of a CoWoS-enabled 3D IC package
2013 · Bahareh Banijamali, Chien-Chia Chiu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 70
A 200-MHz 64-bit Dual-Issue CMOS Microprocessor.
1992 · Daniel W. Dobberpuhl, Richard T. Witek, et al. · Digital technical journal · 69
Distributed ESD protection for high-speed integrated circuits
2000 · B. Kleveland, T.J. Maloney, et al. · IEEE Electron Device Letters · 68
Advancing high performance heterogeneous integration through die stacking
2012 · Liam Madden, Ephrem Wu, et al. · European Solid-State Device Research Conference · 31
Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)
2014 · Woon-Seong Kwon, Suresh Ramalingam, et al. · IMAPSource Proceedings · 27
Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology
2013 · Woon-Seong Kwon, Myongseob Kim, et al. · IMAPSource Proceedings · 27
A programmable RFSoC in 16nm FinFET technology for wideband communications
2017 · Brendan Farley, Ali Boumaalif, et al. · IEEE Asian Solid-State Circuits Conference (A-SSCC) · 26
Advancing high performance heterogeneous integration through die stacking
2012 · Liam Madden, Ephrem Wu, et al. · European Solid-State Circuits Conference (ESSCIRC) · 23
Line inductance extraction and modeling in a real chip with power grid
2003 · B. Kleveland, Xiaoning Qi, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 16
CMOS implementation of a 32 b computer
2003 · R.L. Allmon, W.J. Bowhill, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 10
6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters
2014 · Christophe Erdmann, Donnacha Lowney, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 9
Heterogeneous 3-d stacking, can we have the best of both (technology) worlds?
2013 · Liam Madden · International Symposium on Physical Design · 6
A New Class of High-Capacity, Resource-Rich Field-Programmable Gate Arrays Enabled by Three- Dimensional Integration Chip-Stacked Silicon Interconnect Technology
2018 · Suresh Ramalingam, Henley Liu, et al. · CRC Press eBooks · 3
3-D stacking tutorial introduction
2012 · Liam Madden · IEEE Hot Chips Symposium · 1
Quality and Reliability of 3D High-Performance Heterogeneous Integration through Die Stacking
2012 · Bahareh Banijamali, Liam Madden, et al. · IMAPSource Proceedings · 1
Correction to "exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design"
2002 · B. Kleveland, C.H. Diaz, et al. · IEEE Journal of Solid-State Circuits · 1
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
2015 · Woon-Seong Kwon, Myongseob Kim, et al. · Journal of Microelectronics and Electronic Packaging
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Works count: 27
Citation count: 1,961
H-index: 16
I10-index: 18
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