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S. B. Jan
Observed name:
S.B. Jan
Institution:
Taiwan Semiconductor Manufacturing Company (Taiwan)
Observed institution:
Taiwan Semiconductor Manufacturing Company (Taiwan)
OpenAlex ID:
A5002772048
TSV RF de-embedding method and modeling for 3DIC
2012
·
Hsiao-Tsung Yen
, Yu-ling Lin
, et al.
·
Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
·
20
Thinning, stacking, and TSV proximity effects for Poly and High-K/Metal Gate CMOS devices in an advanced 3D integration process
2012
·
T. Lo
, M. F. Chen
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
14
Orthotropic stress field induced by TSV and its impact on device performance
2011
·
C. C. Hsieh
, H. A. Teng
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
11
Yield and reliability of 3DIC technology for advanced 28nm node and beyond
2011
·
K.F. Yang
, Ting Wu
, et al.
·
Symposium on VLSI Technology
·
9
Next Generation TSMC-SoIC® Platform for Ultra-High Bandwidth HPC Application
2024
·
Yen-Ming Chen
, T. Ko
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
4
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Works count:
5
Citation count:
58
H-index:
4
I10-index:
3
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