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Author

Min Hua Chung

Observed names: M. H. Chung, Min-Hua Chung
Institution: Micron (Taiwan)
ORCID: 0009-0009-0319-5660
Observed ORCID: 0009-0009-0319-5660
OpenAlex ID: A5003084564
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
2023 · Chong Leong Gan, Min-Hua Chung, et al. · Journal of Materials Science Materials in Electronics · 24
Silane modification on mesoporous silica coated carbon nanotubes for improving compatibility and dispersity in epoxy matrices
2015 · Min-Hua Chung, Wei-Hsiang Wang, et al. · Composites Part A Applied Science and Manufacturing · 22
Effects of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites
2014 · Min-Hua Chung, Li-Ming Chen, et al. · Journal of the Taiwan Institute of Chemical Engineers · 20
A review on future novel interconnect and polymeric materials for cryogenic memory packaging
2023 · C. L. Gan, Chen Yu Huang, et al. · Journal of Materials Science Materials in Electronics · 6
Hydrogen as power storage technology, polymeric and interconnect material innovations for future AI datacenter applications: a review
2024 · Chong Leong Gan, Min-Hua Chung, et al. · Journal of Materials Science Materials in Electronics · 4
Innovations needed, reliability issues, and technical challenges in the development of electronic materials for future AI humanoid robots: a critical assessment
2025 · C. L. Gan, M. H. Chung, et al. · Journal of Materials Science Materials in Electronics · 3
Effectiveness of Slow Cure Non-Conductive Film in Void elimination
2022 · Li Jao, Ming Hung Lai, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
Works count: 7
Citation count: 79
H-index: 4
I10-index: 3
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