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Raul Fizesan

Observed names: R. Fizesan, R. T. Fizeșan, Raul T. Fizesan, Raul Traian Fizeșan
ORCID: 0000-0002-7919-9213
Observed ORCID: 0000-0002-7919-9213
OpenAlex ID: A5003104806
Weekly electronic pills dispenser with circular containers
2015 · C. Farcas, I. Ciocan, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 29
Simulation for power integrity to design a PCB for an optimum cost
2010 · Raul Fizesan, Dan Pitica · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 9
Packaging and thermal analysis of power electronics modules
2010 · Lucian Man, Cristian Farcas, et al. · International Spring Seminar on Electronics Technology · 9
Power integrity design tips to minimize the effects of mounting inductance of decoupling capacitors
2012 · Raul Fizesan, Dan Pitica · International Conference on Optimization of Electrical and Electronic Equipment · 7
Pre-layout power integrity analysis in the design flow of a PCB
2011 · Raul Fizesan, Dan Pitica · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 5
Characterization of the V-Model Approach in Thermal Design Process
2019 · A. Fodor, R. Jánó, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 4
PSpice discharge model for simulation circuits with lead-acid battery
2017 · Ovidiu Pop, Adrian Taut, et al. · International Spring Seminar on Electronics Technology · 4
Power integrity analysis and bypass capacitor selection using FDM on a printed circuit board
2009 · Raul T. Fizesan, Dan Pitica, et al. · International Spring Seminar on Electronics Technology · 4
XpertTrack: Precision Autonomous Measuring Device Developed for Real Time Shipments Tracker
2016 · Liviu Viman, Mihai Daraban, et al. · Sensors · 3
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A MATLAB tool to optimize the selection of the decoupling capacitors in a PDN
2012 · Raul Fizesan, Ovidiu Pop · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 3
MATLab platform to calculate the transfer impedance of power and ground planes
2010 · Raul T. Fizesan, Dan Pitica · International Spring Seminar on Electronics Technology · 3
Circuit models for power/ground planes on PCBs using SPICE method
2009 · Raul Fizesan, Dan Pitica · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 3
PCB Design for Reduced Thermal Drift for Current Measurements Through Shunt Resistors
2023 · Toma Ursutiu, Gabriel Chindris, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
Real-Time Embedded Framework Debugger
2022 · Mihai Daraban, Cosmina Corches, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
Influence of switching frequency on active and reactive load power of resonant converters
2016 · Ovidiu Pop, Raul Fizesan, et al. · International Spring Seminar on Electronics Technology · 1
Why the mounting inductance is important in designing a Power Distribution Network?
2015 · Raul Fizesan, Ovidiu Pop, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
Mathematical analysis to control power transfer in resonant power converters
2015 · Adrian Taut, Mihai Daraban, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) · 1
A SPICE analysis on how PDNs can benefit from Crosstalk Avoidance Code
2015 · Mihai Daraban, Raul Fizesan, et al. · International Spring Seminar on Electronics Technology · 1
Parameterized PI SPICE platforms for AC and time-domain simulations
2014 · Raul Fizesan, Ovidiu Pop · International Universities Power Engineering Conference (UPEC) · 1
Empirical Modeling of Current Drawn by High-Speed Circuits for Power Integrity Simulations
2026 · Raul Fizesan · Electronics
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Design and Testing of a Capacitive Sensor for Liquid Level Measurements
2025 · Raul Traian Fizeșan, Andrei Kiss · International Spring Seminar on Electronics Technology
Resistive and Capacitive Sensors Driver for Irrigation Applications
2024 · Alexa Alexandru-Andrei, Raul Fizesan · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
A Qualitative Inquiry into Student Competitions in Electronics in Romania
2024 · T. Ursutiu, G. Chindris, et al. · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
PI Timing Measurements in High Speed Flash Memory Embedded Systems
2018 · R. Fizesan, O. Pop · IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)
2D and 3D representations of the noise in a PCB using analytical methods
2013 · Raul Fizesan, Dan Pitica, et al. · International Spring Seminar on Electronics Technology
Works count: 26
Citation count: 90
H-index: 5
I10-index: 1
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