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Author

Keng-Tuan Chang

Observed name: Keng Tuan Chang
ORCID: 0009-0008-2493-1703
Observed ORCID: 0009-0008-2493-1703
OpenAlex ID: A5003266281
Ultra High Density IO Fan-Out Design Optimization with Signal Integrity and Power Integrity
2019 · Keng Tuan Chang, Chih-Yi Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 37
High Density IO Fan-out Design Optimization with Signal Integrity
2019 · Keng Tuan Chang, Chih Yi Huang, et al. · IEEE CPMT Symposium Japan (ICSJ) · 14
Deep Learning based Refinement for Package Substrate Routing
2023 · Peng-Tai Huang, Tsubasa Koyama, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
A New Semiconductor Package Design Flow and Platform Applied on High Density Fan-out Chip
2021 · Chen-Chao Wang, Chih-Yi Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
High Density Package Design Platform and Assembly Design Kit
2021 · Chih-Yi Huang, Lihong Cao, et al. · International Symposium on Microelectronics · 2
Hybrid Detour Refinement Strategy for Package Substrate Routing
2025 · Ding-Hsun Lin, Tsubasa Koyama, et al. · Asia and South Pacific Design Automation Conference (ASP-DAC) · 1
Semiconductor Package Design Flow and Platform Applied on Fan-out Chip on Substrate
2023 · Youle Lin, Keng-Tuan Chang, et al. · International Conference on Electronics Packaging (ICEP)
Works count: 7
Citation count: 64
H-index: 4
I10-index: 2
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