Author

Shoji Iwakiri

Observed institutions: Kyushu University, Denka (Japan)

OpenAlex ID: A5004159215

Effect of high temperature cycling on both crack formation in ceramics and delamination of copper layers in silicon nitride active metal brazing substrates

2017 · Hiroyuki Miyazakia, Shoji Iwakiri, et al. · Ceramics International · 89

Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity

2018 · Hiroyuki Miyazaki, You Zhou, et al. · Ceramics International · 68

Design and Characterization of a Polarized Coordination Polymer of a Zinc(II) Biphenyldicarboxylate Bearing a Sulfone Group

2009 · Katsuhiko Kanaizuka, Shoji Iwakiri, et al. · Chemistry Letters · 20

Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling

2017 · Shinji Fukuda, Kazuhiko Shimada, et al. · Journal of Materials Science Materials in Electronics · 15

Effect of mechanical properties of the ceramic substrate on the thermal fatigue of Cu metallized ceramic substrates

2016 · Hiroyuki Miyazaki, Shoji Iwakiri, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 13

Thermal-cycling-induced surface roughening and structural change of a metal layer bonded to silicon nitride by active metal brazing

2017 · Shinji Fukuda, Kazuhiko Shimada, et al. · Journal of Materials Science Materials in Electronics · 12

Evaluation of residual thermal stress in Cu metalized silicon nitride substrates by raman spectroscopy

2018 · Kiyoshi Hirao, Shinji Fukuda, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 10

Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates

2019 · Shinji Fukuda, Kazuhiko Shimada, et al. · Journal of Materials Science Materials in Electronics · 4

Effects of phosphorus content on generation and growth of cracks in nickel–phosphorus platings owing to thermal cycling

2018 · Shinji Fukuda, Kazuhiko Shimada, et al. · Journal of Materials Science Materials in Electronics · 4

Accelerated thermal fatigue test of metallized ceramic substrates for SiC power modules by repeated four-point bending

2018 · Hiroyuki Miyazaki, Hideki Hyuga, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 3

Development of Thermal Fatigue-Tolerant Active Metal Brazing Substrates Using Highly-Thermal Conductive Silicon Nitrides with High Toughness

2017 · Hiroyuki Miyazaki, You Zhou, et al. · 3

Defects in nickel plating layers on copper-metallized substrates induced by thermal cycles

2016 · Shinji Fukuda, Kazuhiko Shimada, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Highly thermal-fatigue resistant Si3N4 substrates with excellent mechanical and thermal properties

2017 · Hiroyuki Miyazaki, You Zhou, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs

Works count: 13

Citation count: 243

H-index: 7

I10-index: 7