Get started
Author

Yasir Sulehria

Observed names: Sulehria Yasir, Sulehria, Yasir, Y. Sulehria
ORCID: 0009-0007-2241-529X
Observed ORCID: 0009-0007-2241-529X
OpenAlex ID: A5004394661
Backside Power Distribution for Nanosheet Technologies Beyond 2nm
2024 · Ruilong Xie, Wonhyuk Hong, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 26
Advanced BEOL Interconnects
2020 · Takeshi Nogami, Oleg Gluschenkov, et al. · IEEE International Interconnect Technology Conference (IITC) · 14
NanoStack Transistor Architecture for CMOS 7A Node and Beyond
2025 · S. Reboh, C. Zhang, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 13
D2W and W2W Hybrid Bonding System with Below 2.5 Micron Pitch for 3D Chiplet AI Applications
2024 · Katsuyuki Sakuma, Roy Yu, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 13
External Resistance Reduction by Nanosecond Laser Anneal in Si/SiGe CMOS Technology
2018 · Oleg Gluschenkov, Heng Wu, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 12
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
2023 · Qianwen Chen, Michael Belyansky, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
2022 · Takeshi Nogami, Oleg Gluschenkov, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 10
Impact of Nanosecond Laser Anneal on PVD Ru Films
2021 · D. Sil, Y. Sulehria, et al. · IEEE International Interconnect Technology Conference (IITC) · 6
Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams
2023 · Akira Uedono, Takeshi Nogami, et al. · Journal of Applied Physics · 3
Improving FinFET Junctions and Contacts via Laser Annealing
2023 · Oleg Gluschenkov, Yasir Sulehria, et al. · International Workshop on Junction Technology · 3
Impact of Gate Stack Thermal Budget on NBTI Reliability in Gate-All-Around Nanosheet P-type Devices
2023 · Huimei Zhou, Miaomiao Wang, et al. · IEEE International Reliability Physics Symposium proceedings · 3
Hot Carrier Degradation and performance boost on Si Channel nFET Gate-All-Around Nanosheet Devices
2025 · H. Zhou, M. Hasanuzzaman, et al. · IEEE International Reliability Physics Symposium proceedings · 2
Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition
2017 · Anuja De Silva, Indira Seshadri, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 1
Development of TiO2containing hardmasks through PEALD deposition
2017 · Anuja De Silva, Indira Seshadri, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Backside Contact Resistivity Reduction for Nanosheet Technologies Beyond 2nm by Backside Nanosecond Laser Anneal Without Impacting the Frontside Cu BEOL
2026 · Ruilong Xie, Kevin Brew, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
2025 · Sarabjot Singh, Sangshin Jang, et al. · IEEE International Interconnect Technology Conference (IITC)
Energy Density and Temperature Calibration for FEOL Nanosecond Laser Annealing
2020 · Yasir Sulehria, Oleg Gluschenkov, et al. · ASMC proceedings
Feolナノ秒レーザアニーリングのためのエネルギー密度と温度キャリブレーション【jst・京大機械翻訳】
2020 · Sulehria Yasir, Oleg Gluschenkov, et al. · IEEE Conference Proceedings
Effect of chamber surface coat on TiN film growth
2019 · Shanti Pancharatnam, Jean Wynne, et al. · ASMC proceedings
Works count: 20
Citation count: 117
H-index: 7
I10-index: 7
Year
Topic
Type