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Stuart Erickson
Observed name:
S. Erickson
Institution:
Ultra Electronics (Canada)
Observed institutions:
Northpoint Bible College,
Ultra Electronics (Canada)
OpenAlex ID:
A5004504001
EMI Shielding for System in Package using Nozzle-Less Ultrasonic Spray Coating and Silver Particle Free Ink
2020
·
Stuart Erickson
, Garret McKerricher
, et al.
·
International Wafer Level Packaging Conference (IWLPC)
·
9
Application of package-level high-performance EMI shield material with a novel nozzleless spray coating technology
2020
·
Stuart Erickson
, Mike Sakaguchi
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
Water Washable Coatings for Plasma Dicing Processes
2019
·
Matthew Day
, Larry Sirois
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
6
Patterning High Resolution Features Through the Integration of an Advanced Lithography System with a Novel Nozzleless Spray Coating Technology
2018
·
Jack Mach
, Corey Shay
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Producing Vias in Photosensitive Polyimide Passivation Layers for Fan Out PLP Through the Integration of an Advanced Lithography System with a Novel Nozzle-Less Spray Coating Technology
2019
·
Stuart Erickson
, Christian Ayala
, et al.
·
International Wafer Level Packaging Conference (IWLPC)
·
3
Reducing the Cost of Applying Ultra-Thin, Package Level EMI Shield Coatings
2018
·
Stuart Erickson
·
International Wafer Level Packaging Conference (IWLPC)
·
3
New application method for package level EMI shield coating
2018
·
Stuart Erickson
·
China Semiconductor Technology International Conference (CSTIC)
·
2
Precision flux deposition techniques for semiconductor applications
2004
·
S. Erickson
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
1
Producing Planarized Uniform Layer in Advanced Photosensitive Polyimide Over Complex Geometry for Fan Out PLP Applied with a Novel Nozzle-Less Spray Coating Technology
2020
·
Stuart Erickson
, Sanjay Malik
·
International Wafer Level Packaging Conference (IWLPC)
Emi Shielding for System in Package Using Nozzle-Less Ultrasonic Spray Coating and Silver Particle Free Ink
2020
·
Stuart Erickson
, Garret McKerricher
, et al.
·
Wafer-Level Packaging Symposium
Producing Planarized Uniform Layer in Advanced Photosensitive Polyimide Over Complex Geometry for Fan Out PLP Applied with a Novel Nozzle-Less Spray Coating Technology
2020
·
Stuart Erickson
, Sanjay Malik
·
Wafer-Level Packaging Symposium
Producing Vias in Photosensitive Polyimide Passivation Layers for Fan Out PLP Through the Integration of an Advanced Lithography System with a Novel Nozzle-Less Spray Coating Technology
2019
·
Stuart Erickson
, Christian Ayala
, et al.
·
Wafer-Level Packaging Symposium
Reducing the Cost of Applying Ultra-Thin, Package Level EMI Shield Coatings
2018
·
Stuart Erickson
·
Wafer-Level Packaging Symposium
Precision Coating Deposition Techniques for Conformal Coating Applications
2006
·
Stuart Erickson
·
SMTA International
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Works count:
14
Citation count:
35
H-index:
4
I10-index:
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