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Bruce Cory
Observed names:
B. Cory,
B.D. Cory
Institution:
Nvidia (United States)
Observed institution:
Nvidia (United States)
OpenAlex ID:
A5004526258
Speed binning with path delay test in 150-nm technology
2003
·
B.D. Cory
, R. Kapur
, et al.
·
IEEE Design & Test of Computers
·
111
An Industrial Study of System-Level Test
2012
·
Sounil Biswas
, Bruce Cory
·
IEEE Design & Test of Computers
·
35
Scan chain failure analysis using laser voltage imaging
2010
·
Joy Y. Liao
, Steven Kasapi
, et al.
·
Microelectronics Reliability
·
20
Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing
2011
·
Steven Kasapi
, William Lo
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
16
Advanced scan chain failure analysis using laser modulation mapping and continuous wave probing
2012
·
Steven Kasapi
, William Lo
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
12
X-Ray Device Alteration Using a Scanning X-Ray Microscope
2022
·
William Lo
, Puneet Gupta
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
9
Systematic defect screening in controlled experiments using volume diagnosis
2012
·
B. Seshadri
, P. Gupta
, et al.
·
IEEE International Test Conference (ITC)
·
7
Comparison of applications of laser probing, laser-induced circuit perturbation and photon emission for failure analysis and yield enhancement
2012
·
Steven Kasapi
, Roy Ng
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
4
Volume Electrical Failure Analysis for Product-Specific Yield Enhancement
2010
·
Steven Kasapi
, Joy Liao
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
4
SRAM Bitmap Validation Using Laser-Induced Damage for FinFET ICs
2016
·
William Lo
, Puneet Gupta
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
·
2
Foundry workflow for dynamic-EFA-based yield ramp
2011
·
C. Kardach
, I. Kapilevich
, et al.
·
Microelectronics Reliability
·
2
OCI: Open Compression Interface
2006
·
Bruce Cory
, Rohit Kapur
, et al.
·
IEEE International Test Conference (ITC)
·
1
The Role of ATPG Fault Diagnostics in Driving Physical Analysis
2006
·
Roger Nicholson
, Cathy Kardach
, et al.
·
IEEE International Test Conference (ITC)
·
1
Investigating Decap LVP for On-Die Dynamic Voltage Droop Measurement
2025
·
William Lo
, Nicholas Callegari
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
V-Pulse Technique For Optical Isolation Of Latchup Triggers In Sub-14 nm Standard-Cell Logic And Memory
2019
·
William Lo
, Puneet Gupta
, et al.
·
Proceedings - International Symposium for Testing and Failure Analysis
Innovative practices session 9C: Yield improvement: Challenges and directions
2013
·
B. Seshadri
, B. Cory
, et al.
·
IEEE VLSI Test Symposium (VTS)
How much insurance can you afford?
2007
·
Bruce Cory
·
IEEE International Test Conference (ITC)
HVM of High Speed I/O: We Need Many Options But Don't Want to Use Them
2006
·
Bruce Cory
·
IEEE International Test Conference (ITC)
Needs fabless yield ramp foundry partnership to be most successful
2006
·
B. Cory
·
IEEE International Test Conference (ITC)
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Works count:
19
Citation count:
224
H-index:
7
I10-index:
5
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