Author

Xueqiong Fu

Institution: Anyang Normal University

Observed institutions: Chinese Academy of Sciences, Anyang Normal University, Shenzhen Institutes of Advanced Technology, Shenzhen Institute of Advanced Electronic Materials

ORCID: 0000-0003-0508-4373

Observed ORCID: 0000-0003-0508-4373

OpenAlex ID: A5004526988

Numerical homogenization of thermal conductivity of particle-filled thermal interface material by fast Fourier transform method

2021 · Xiaoxin Lu, Xueqiong Fu, et al. · Nanotechnology · 22

Nanostructure, Plastic Deformation, and Influence of Strain Rate Concerning Ni/Al2O3 Interface System Using a Molecular Dynamic Study (LAMMPS)

2023 · Xueqiong Fu · Nanomaterials · 12

Efficient numerical and ANN models for optimization of filler gradation of particulate-filled composites

2023 · Xueqiong Fu, Yuhan Mao, et al. · Powder Technology · 7

Order-disorder transition during shear thickening in bidisperse dense suspensions

2024 · Xueqiong Fu, Yanwei Liu, et al. · Journal of Colloid and Interface Science · 5

Characterization and Simulation of Nanoscale Catastrophic Failure of Metal/Ceramic Interfaces

2023 · Xueqiong Fu, Lihong Liang, et al. · ACS Omega · 5

Coordination number of densest ternary sphere packings

2026 · Xueqiong Fu, Huandong Ruan, et al. · Powder Technology

Microstructure and thickening of bi-disperse granular suspensions in simple shear flow

2026 · Xueqiong Fu, Ge Li, et al. · Journal of Fluid Mechanics

Plastic deformation of Ag/MgO interface system during tensile fracture: A molecular dynamics study

2023 · Xueqiong Fu · Applied and Computational Engineering

Numerical study on rheological properties of epoxy/SiO2 ternary packing composites

2022 · Xueqiong Fu, Jibao Lu, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Works count: 9

Citation count: 51

H-index: 5

I10-index: 2