Author

Sebastian Quednau

Observed names: Quednau, Sebastian, S Quednau, S. QUEDNAU, S. Quednau

Observed institution: Technische Universität Darmstadt

OpenAlex ID: A5004713040

High aspect ratio gold nanopillars on microelectrodes for neural interfaces

2013 · C. Nick, S. Quednau, et al. · Microsystem Technologies · 32

Fabrication techniques for multiscale 3D-MEMS with vertical metal micro- and nanowire integration

2013 · F Greiner, S Quednau, et al. · Journal of Micromechanics and Microengineering · 20

Low-Resistance Room-Temperature Interconnection Technique for Bonding Fine Pitch Bumps

2021 · F. Roustaie, S. Quednau, et al. · Journal of Materials Engineering and Performance · 16

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Room Temperature Interconnection Technology for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing

2020 · F. ROUSTAIE, S. QUEDNAU, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 11

Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration

2024 · Steffen Bickel, Sebastian Quednau, et al. · Journal of Electronic Materials · 10

In situ synthesis of metallic nanowire arrays for ionization gauge electron sources

2016 · Farough Roustaie, Sebastian Quednau, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 10

Room Temperature KlettWelding Interconnect Technology for High Performance CMOS Logic

2021 · Farough Roustaie, Sebastian Quednau, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8

Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D Integration

2022 · Adil Shehzad, Ran Yin, et al. · Electronic System-Integration Technology Conference (ESTC) · 6

Optimizing the Nano Wiring and KlettSintering parameters for low-temperature die to DCB attach of power electronic chips

2021 · D. Strahringer, F. Roustaie, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 3

Galvanisch erzeugt Mikro- und Nanodrähte für die Gasflusssensorik

2016 · Quednau, Sebastian · Technischen Universität Darmstadt · 3

Cu nanowire fine-pitch joints for next gen heterogeneous chiplet integration

2024 · Steffen Bickel, Sebastian Quednau, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2

Experimental Study of a Novel Printed Circuit Board Interconnection Technology

2024 · Karamat Adavi, Sebastian Quednau, et al. · International Spring Seminar on Electronics Technology · 2

Integration of Nanochannels for Lab-on-Chip-Systems

2016 · Mario El Khoury, Sebastian Quednau, et al. · 2

Vor-Ort-Erzeugung von Mikro- und Nanodrähten auf geraden und gekrümmten Oberflächen

2015 · Konja Wick, Farough Roustaie, et al. · TUbilio (Technical University of Darmstadt) · 2

Integration und Charakterisierung von Nanostrukturen in Mikrosysteme für sensorische Anwendungen

2014 · Sebastian Quednau, Florian Dassinger, et al. · 2

B2.4 - Numerical simulation of a MEMS Pirani vacuum sensor

2013 · S. Quednau, H. F. Schlaak, et al. · SENSOR International Conference on Sensors and Measurement Technology (SENSOR) · 2

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Fine-Pitch Die-to-Wafer Bonding Technologies for Chiplet Integration

2025 · Juliana Panchenko, Laura Wenzel, et al. · European Microelectronics and Packaging Conference · 1

Interconnect Reliability for Single-Step Sintered Die Stack

2025 · Nikhil Gupta, Guoqi Zhang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1

Strukturierung von Elektronen-Feldemitter auf Basis metallischer Nanodrähte

2014 · Farough Roustaie, Stefan Wilfert, et al. · TUbilio (Technical University of Darmstadt) · 1

Growth In-Place Integration of Metallic Nanowires into MEMS Gas Flow Sensors

2014 · Sebastian Quednau, Florian Dassinger, et al. · 1

Passive Intermodulation Estimation of a Novel Printed Circuit Board Interconnection Technology Based on Static I-V

2024 · Karamat Adavi, Sebastian Quednau, et al. · Electronic System-Integration Technology Conference (ESTC)

Advanced packaging for future demands

2017 · Sascha Lohse, Michael Wolff, et al. · IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

In-place synthesis of metallic nanowire arrays for the use in an ionization vacuum gauge

2015 · F. Roustaie, S. Quednau, et al. · International Vacuum Nanoelectronics Conference

B2.4 - Lithographically defined nickel wires for gasflow sensing applications

2015 · S. Quednau, H. F. Schlaak · SENSOR International Conference on Sensors and Measurement Technology (SENSOR)

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Gold nanopillar microelectrodes on low temperature curing polyimide for the interface with electrogenic cells

2014 · C. Nick, P. Lippert, et al. · Middle East Conference on Biomedical Engineering

Works count: 38

Citation count: 135

H-index: 7

I10-index: 6