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Selin Tolunay Wipf

Observed names: S. Tolunay, S. Tolunay Wipf, S. Tolunay-Wipf, S. Wipf, S.T. Wipf, Selin Tolunay, Tolunay Wipf Selin, Tolunay Wipf, Selin
Observed institutions: Centre National de la Recherche Scientifique, Motorola (United States), China Academy of Engineering Physics, Boğaziçi University, Université Grenoble Alpes, Leibniz Institute for High Performance Microelectronics
ORCID: 0000-0003-3894-8545
Observed ORCID: 0000-0003-3894-8545
OpenAlex ID: A5005168917
D–Band RF–MEMS SPDT Switch in a $0.13~\mu$ m SiGe BiCMOS Technology
2016 · Selin Tolunay Wipf, Alexander Goritz, et al. · IEEE Microwave and Wireless Components Letters · 30
Substrate Integrated Waveguides for mm-wave Functionalized Silicon Interposer
2018 · Matthieu Bertrand, Emmanuel Pistono, et al. · IEEE MTT-S International Microwave Symposium digest · 28
Optimization of a SiGe:C HBT in a BiCMOS technology for low power wireless applications
2003 · J.P. John, F. Chai, et al. · Proceedings of the ... Bipolar/BiCMOS Circuits and Technology Meeting/Proceedings of the ... BipolarBiCMOS Circuits and Technology Meeting · 25
A 125–143-GHz Frequency-Reconfigurable BiCMOS Compact LNA Using a Single RF-MEMS Switch
2019 · Julio Heredia, Miquel Ribó, et al. · IEEE Microwave and Wireless Components Letters · 23
Thin film wafer level encapsulated RF-MEMS switch for D-Band applications
2016 · S. Tolunay Wipf, A. Göritz, et al. · European Microwave Integrated Circuits Conference · 16
220GHz wide-band MEMS switch in standard BiCMOS technology
2015 · Y. J. Du, W. Su, et al. · IEEE Asian Solid-State Circuits Conference (A-SSCC) · 15
Micromachined sample stages to reduce thermal drift in atomic force microscopy
2014 · Semih Sevim, Selin Tolunay, et al. · Microsystem Technologies · 15
Single-chip transmit-receive module with a fully integrated differential RF-MEMS antenna switch and a high-voltage generator for F-band radars
2015 · Václav Valenta, Hermann Schumacher, et al. · 12
Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
2020 · Kai Zoschke, Piotr Mackowiak, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 10
Al-Al Direct Bonding with Sub-µm Alignment Accuracy for Millimeter Wave SiGe BiCMOS Wafer Level Packaging and Heterogeneous Integration
2019 · Matthias Wietstruck, Sebastian Schulze, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 10
240 GHz RF-MEMS switch in a 0.13 μm SiGe BiCMOS Technology
2017 · S. Tolunay Wipf, A. Göritz, et al. · Proceedings of the ... Bipolar/BiCMOS Circuits and Technology Meeting/Proceedings of the ... BipolarBiCMOS Circuits and Technology Meeting · 10
Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS Technology
2022 · Alexander Göritz, Selin Tolunay Wipf, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 9
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Recent Developments on SiGe BiCMOS Technologies for mm-wave and THz Applications
2019 · Matthias Wietstruck, Steffen Marschmeyer, et al. · IEEE MTT-S International Microwave Symposium digest · 9
0.13-μm SiGe BiCMOS technology with More-than-Moore modules
2017 · M. Kaynak, M. Wietstruck, et al. · Proceedings of the ... Bipolar/BiCMOS Circuits and Technology Meeting/Proceedings of the ... BipolarBiCMOS Circuits and Technology Meeting · 8
BEOL modifications of a 130 nm SiGe BiCMOS technology for monolithic integration of thin-film wafer-level encapsulated D-Band RF-MEMS switches
2021 · Alexander Goritz, Selin Tolunay Wipf, et al. · Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) · 7
Thin film wafer level encapsulated RF-MEMS switch for D-band applications
2016 · S. Tolunay Wipf, A. Göritz, et al. · European Microwave Conference (EuMC) · 6
D-Band Flip-Chip Packaging with Wafer-Level Cu-pillar Bumps
2023 · Zhibo Cao, Matteo Stocchi, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) · 5
Miniature Switchable Millimeter-Wave BiCMOS Low-Noise Amplifier at 120/140 GHz Using an HBT Switch
2019 · Julio Heredia, Miquel Ribó, et al. · Micromachines · 5
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A Modular Phased Array Transceiver with RF-MEMS SPDT Switches in a 0.25 μm SiGe BiCMOS Technology
2018 · T. Chaloun, F. Tabarani, et al. · European Conference on Antennas and Propagation · 4
Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
2017 · Selin Tolunay Wipf, Alexander Göritz, et al. · IMAPS Nordic Conference on Microelectronics Packaging (NordPac) · 4
Electromagnetic and small-signal modeling of an encapsulated RF-MEMS switch for D-band applications
2017 · Selin Tolunay Wipf, Alexander Göritz, et al. · International Journal of Microwave and Wireless Technologies · 4
The Emergence of SiGe:C HBT Technology for RF Applications
2003 · V. Ilderem, Selin Tolunay Wipf, et al. · 4
Full-wave RF Modeling of a Fan-Out Wafer-Level Packaging Technology Based on Al-Al Wafer Bonding
2020 · M. Stocchi, M. Wietstruck, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 3
Finite-element modelling of stress induced wafer warpage for a full BiCMOS process
2019 · Zhibo Cao, Alexander Göritz, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 3
Design Optimization of Through-Silicon Vias for Substrate-Integrated Waveguides embedded in High-Resistive Silicon Interposer
2018 · M. Wietstruck, S. Marschmeyer, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3
Works count: 46
Citation count: 284
H-index: 10
I10-index: 11
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