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Christoph Flötgen

Observed names: C Flötgen, C. Flotgen, C. Flötgen, Christoph Floetgen, Christoph Flotgen, Flötgen, Christoph
Institution: EV Group (Austria)
OpenAlex ID: A5005648057
Inactivation of Bacteria and Biomolecules by Low‐Pressure Plasma Discharges
2010 · A. von Keudell, P. Awakowicz, et al. · Plasma Processes and Polymers · 159
Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g
2016 · Romain Cariou, Jan Benick, et al. · IEEE Journal of Photovoltaics · 122
Calibration of a miniaturized retarding field analyzer for low-temperature plasmas: geometrical transparency and collisional effects
2010 · Tim Baloniak, Rüdiger Reuter, et al. · Journal of Physics D Applied Physics · 56
Wafer bonding using Cu–Sn intermetallic bonding layers
2013 · C. Flötgen, M. Pawlak, et al. · Microsystem Technologies · 19
A model for spectroscopic ellipsometry analysis of plasma-activated Si surfaces for direct wafer bonding
2022 · N. Rauch, E. Andersen, et al. · Applied Physics Letters · 17
Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication
2014 · Christoph Flötgen, Nasser Razek, et al. · ECS Transactions · 15
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Etching ofBacillus atrophaeusby oxygen atoms, molecules and argon ions
2008 · J Benedikt, C Flötgen, et al. · Journal of Physics Conference Series · 13
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Surface pretreated low-temperature aluminum–aluminum wafer bonding
2017 · Andreas P. Hinterreiter, Bernhard Rebhan, et al. · Microsystem Technologies · 12
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Cu-Sn transient liquid phase wafer bonding for MEMS applications
2013 · C. Flötgen, M. Pawlak, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10
Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding
2016 · Christoph Flötgen, Nasser Razek, et al. · ECS Transactions · 8
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Cu-Sn Transient Liquid Phase Wafer Bonding: Process Parameters Influence on Bonded Interface Quality
2013 · Christoph Floetgen, Kevin Corn, et al. · ECS Transactions · 6
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Radiation hard four-junction space solar cell based on GaInAsP alloys
2019 · David Lackner, Jonas Schon, et al. · European Space Power Conference (ESPC) · 5
Characterization of Wafer-Bonded Oxide-Free Silicon with Surfaces Treated with an Ion-Bombardment Procedure
2018 · Michael Liao, Chao Li, et al. · ECS Transactions · 5
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Characterization of Siliconcarbonitride bonding layer for plasma activated direct fusion bonding
2024 · David Doppelbauer, Christoph Floetgen, et al. · IEEE International Interconnect Technology Conference (IITC) · 3
Metal wafer bonding for 3D interconnects and advanced packaging
2012 · V. Dragoi, E. Pabo, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
CMOS-compatible aligned fusion wafer bonding
2011 · V. Dragoi, G. Mittendorfer, et al. · CAS proceedings · 3
Enhanced process control for plasma triggered oxide growth in plasma activated wafer bonding
2024 · Christoph Floetgen, Ignacio Gabriel Vicente Gabás, et al. · IEEE International Interconnect Technology Conference (IITC) · 2
Wafer bonding for CMOS integration and packaging
2012 · V. Dragoi, F. Kurz, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Wafer-to-Wafer Bonding for Advanced Manufacturing Nodes
2024 · Thomas Plach, Anton Alexeev, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
A Systematic Approach for Tuning Plasma-Specific Process Results in Plasma-Activated Low-Temperature Wafer-to-Wafer Bonding
2024 · D. Doppelbauer, I. G. Vicente Gabás, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
Ion Species Dependence on the Interfacial Properties of Silicon Homojunctions Bonded Using an Ion Bombardment Treatment
2020 · Michael Evan Liao, Kenny Huynh, et al. · ECS Transactions · 1
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Wafer Bonding
2020 · Bernhard Rebhan, Viorel Dragoi, et al. · Wiley eBooks · 1
Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding
2016 · Christoph Flötgen, Nasser Razek, et al. · ECS Meeting Abstracts · 1
Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication
2014 · Christoph Flötgen, Nasser Razek, et al. · ECS Meeting Abstracts · 1
Wafer bonding for vacuum encapsulated MEMS
2013 · V. Dragoi, M. Pawlak, et al. · CAS proceedings · 1
Works count: 38
Citation count: 467
H-index: 9
I10-index: 9
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