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Josef Skácel

Observed names: J. Skacel, Josef Skacel, Skacel Josef, Skácel, Josef
Observed institution: Brno University of Technology
OpenAlex ID: A5005926460
Welfare of the mealworm (Tenebrio molitor) breeding with regard to nutrition value and food safety
2017 · Anna Adámková, Martin Adámek, et al. · Potravinarstvo Slovak Journal of Food Sciences · 45
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Detection of selected heavy metals and micronutrients in edible insect and their dependency on the feed using XRF spectrometry
2017 · Jiří­ Mlček, Martin Adamek, et al. · Potravinarstvo Slovak Journal of Food Sciences · 30
Plasma Nanocoatings Developed to Control the Shear Strength of Polymer Composites
2019 · Milan Zvonek, Veronika Sirjovova, et al. · Polymers · 12
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3D Printed Fused Deposition Modeling (FDM) Capillaries for Chemiresistive Gas Sensors
2023 · Martin Adamek, Jiri Mlcek, et al. · Sensors · 6
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Electronic nose in edible insects area
2017 · Martin Adámek, Anna Adámková, et al. · Potravinarstvo Slovak Journal of Food Sciences · 6
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Influence of Electric Current at Solidification of Solder
2019 · Josef Skacel, Alexandr Otahal, et al. · International Spring Seminar on Electronics Technology · 5
Current Load of Thick-film Pastes for Power Applications
2020 · Josef Skacel, Alexandr Otahal, et al. · International Spring Seminar on Electronics Technology · 2
X-ray Inspection of Ceramic Structures
2018 · Josef Skacel, Alexandr Otahal, et al. · International Spring Seminar on Electronics Technology · 2
Eco-label and Self Environmental Claims in Electronics
2018 · Ivan Szendiuch, Edita Hejatkova, et al. · International Spring Seminar on Electronics Technology · 2
Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications
2023 · Larisa Chmelikova, Peter Fecko, et al. · Applied Materials Today · 1
Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure
2021 · Josef Skacel, Alexandr Otahal, et al. · International Spring Seminar on Electronics Technology · 1
Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys
2020 · Alexandr Otahal, Josef Skacel, et al. · International Spring Seminar on Electronics Technology · 1
Unusual aspects of the fat content of mealworm larvae as a novel food
2019 · Martin Adámek, Jiří­ Mlček, et al. · Potravinarstvo Slovak Journal of Food Sciences · 1
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Three ways to ceramic packages
2017 · Josef Skacel, Ivan Szendiuch · International Spring Seminar on Electronics Technology · 1
Prediction of the thick film resistor trimming
2017 · Josef Skácel, Jan Kolařı́k, et al. · Digital Library (University of West Bohemia) · 1
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Designing of infrared heater with homogenous heat transfer
2016 · Josef Skacel, Alexandr Otahal, et al. · International Spring Seminar on Electronics Technology · 1
The mechanical strength of solder joints on PCB with OSP surface protection
2016 · Vaclav Novotny, Martin Adamek, et al. · International Spring Seminar on Electronics Technology · 1
Influence of Carbon Nanotube Addition on Electrical and Thermal Properties of Conductive Die-Attach Adhesives
2026 · Pavel Kopřiva, Josef Skácel, et al. · International Spring Seminar on Electronics Technology
Development of a New Ceramic Package Design for Special Applications
2025 · Pavel Kopřiva, Josef Skácel, et al. · International Spring Seminar on Electronics Technology
The influence of current on the structure of the intermetallic compound in solder alloys
2025 · Josef Skácel, Alexandr Otáhal · Journal of Electrical Engineering
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Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage
2023 · Alexandr Otáhal, Imrich Gablech, et al. · International Spring Seminar on Electronics Technology
Scratch tester
2022 · Petr Brandejs, Josef Skácel · Conference STUDENT EEICT
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Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages
2021 · Alexandr Otahal, Josef Skacel, et al. · International Spring Seminar on Electronics Technology
Ecolabeling of Electronics Products – what is new and what next?
2020 · Ivan Szendiuch, Edita Hejatkova, et al. · International Spring Seminar on Electronics Technology
New Possible Way for Brazing of Thick Film Cermet Conductors
2019 · Alexandr Otahal, Josef Skacel, et al. · International Spring Seminar on Electronics Technology
Works count: 35
Citation count: 117
H-index: 5
I10-index: 3
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