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R. Pelzer

Observed names: Pelzer, R., R L Pelzer, R Pelzer, RAINER PELZER, Rainer Pelzer
OpenAlex ID: A5005932666
Uniformity across 200 mm silicon wafers printed by nanoimprint lithography
2004 · C Gourgon, C Perret, et al. · Journal of Physics D Applied Physics · 41
High temperature storage reliability investigation of the Al–Cu wire bond interface
2012 · R. Pelzer, M. Nelhiebel, et al. · Microelectronics Reliability · 38
On the effects of thickness on adhesion of TiW diffusion barrier coatings in silicon integrated circuits
2014 · A. Roshanghias, G. Khatibi, et al. · Surface and Coatings Technology · 26
New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications
2006 · P Kettner, R L Pelzer, et al. · Journal of Physics Conference Series · 25
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Role of intermetallics on the mechanical fatigue behavior of Cu–Al ball bond interfaces
2015 · A. Lassnig, R. Pelzer, et al. · Journal of Alloys and Compounds · 22
Growth behavior and physical response of Al-Cu intermetallic compounds
2014 · Rainer Pelzer, Stefan Woehlert, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 15
Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications
2006 · R. Pelzer, H. Kirchberger, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 14
Accelerated lifetime estimation of thermosonic Cu ball bonds on Al metallization
2013 · A. Lassnig, W. Trasischker, et al. · Microelectronic Engineering · 9
Cross-sectional nanoindentation (CSN) studies on the effect of thickness on adhesion strength of thin films
2014 · A Roshanghias, G Khatibi, et al. · Journal of Physics D Applied Physics · 8
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Thickness dependency of adhesion properties of TiW thin films
2014 · A. Roshangias, R. Pelzer, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
Nanoimprint lithography: full wafer replication of nanometer features
2005 · Rainer Pelzer, Cecile Gourgon, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages
2013 · P. Rafiee, G. Khatibi, et al. · Microelectronics Reliability · 4
Large-scale lithography for sub-500nm features
2006 · R L Pelzer, T Steininger, et al. · Journal of Physics Conference Series · 4
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Advanced low temperature bonding technologies
2004 · R. Pelzer, V. Dragoi, et al. · IEEE International Conference on Semiconductor Electronics · 4
Accelerated lifetime measurements of Cu-Al ball bonded interconnects
2012 · A. Lassnig, R. Pelzer, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Nanostructuring of polymers by hot embossing lithography
2004 · Hella-Christin Scheer, Thomas Glinsner, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
High cycle fatigue testing of thermosonic ball bonds
2017 · A. Lassnig, M. Lederer, et al. · Microelectronics Reliability · 2
Wafer-scale BCB Resist-Processing Technologies for High Density Integration and Electronic Packaging
2006 · R. Pelzer, V. Dragoi, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 2
Plasma Activated Bonding and Imprinting of Polymer by Hot Embossing for Packaging Applications
2005 · RAINER PELZER, SHARON FARRENS, et al. · International Journal of Nanoscience · 2
Temperature Reduced Direct Bonding By Plasma Assisted Wafer Surface Pre-Treatment
2006 · R. Pelzer, V. Dragoi, et al. · Electronic Packaging Technology Conference · 1
ECPR (electrochemical pattern replication): metal printing for advanced packaging applications
2005 · P. Moller, M. Fredenberg, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Advances in lithography technologies for wafer-level packaging
2003 · R. Pelzer, P. Kettner, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Influence of Electronic Laminate Architecture on Moisture Uptake and Reliability Consequence under HAST Conditions
2026 · Katrin Unger, Florian Tschelisnig, et al. · Harsh Environments Conference
Lifetime of thermosonic copper ball bonds on aluminum metallization pads
2011 · W. Trasischker, A. Lassnig, et al. · IEEE International Interconnect Technology Conference (IITC)
Plasma Bonding Replacement Methods for Traditional Bond Technologies
2006 · Shari Farrens, Viorel Dragoi, et al. · ECS Meeting Abstracts
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Works count: 35
Citation count: 237
H-index: 8
I10-index: 7
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