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Franz Selbmann

Observed names: F. Selbmann, Selbmann, F., Selbmann, Franz
ORCID: 0000-0002-1053-2196
Observed ORCID: 0000-0002-1053-2196
OpenAlex ID: A5005956779
Membrane-Based NEMS/MEMS Biosensors
2024 · Hannes Stapf, Franz Selbmann, et al. · ACS Applied Electronic Materials · 34
Deposition of Parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices
2016 · Franz Selbmann, Mario Baum, et al. · IEEE International Conference on Nano/Micro Engineered and Molecular Systems · 25
Impact of Non-Accelerated Aging on the Properties of Parylene C
2022 · Franz Selbmann, Christina Scherf, et al. · Polymers · 21
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An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene
2021 · Franz Selbmann, Frank Roscher, et al. · 18
Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems
2021 · Franz Selbmann, Mario Baum, et al. · ECS Journal of Solid State Science and Technology · 17
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Fine line metallization by coextrusion technology for next generation solar cells
2014 · M. Beutel, A. Lewis, et al. · Solar Energy Materials and Solar Cells · 15
Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS
2015 · Lutz Hofmann, Tobias Fischer, et al. · Microsystem Technologies · 10
Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates
2023 · Franz Selbmann, Soumya Deep Paul, et al. · Micromachines · 7
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Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems
2023 · Franz Selbmann, Frank Roscher, et al. · European Microelectronics and Packaging Conference & Exhibition (EMPC) · 6
Ligninsulfonate-based hydrogel films for ion sensing
2023 · Johanna Phuong Nong, Paul Nawroth, et al. · European Polymer Journal · 5
Greenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming
2023 · Moritz Schlagmann, Joseph Stoenner, et al. · 5
Hot Embossing to Fabricate Parylene-Based Microstructures and Its Impact on the Material Properties
2024 · Florian Glauche, Franz Selbmann, et al. · Polymers · 4
Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration
2023 · I. Cirulis, U. Zschenderlein, et al. · European Microelectronics and Packaging Conference & Exhibition (EMPC) · 4
Miniaturized and Highly Integrated Humidity Sensor with Biocompatible Sensing Material for Smart Farming
2022 · Moritz Schlagmann, Franz Selbmann, et al. · 4
Sealing of glass with titanium by glass pressing at the softening point
2019 · Sebastian Winkler, Jan Edelmann, et al. · SN Applied Sciences · 4
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Parylene as a Novel Packaging Material for Adhesive Bonding, Flexible Electronics and Wafer Level Packaging
2024 · Franz Selbmann, Martin Kühn, et al. · Electronics System-Integration Technology Conference (ESTC) · 3
Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting
2021 · Franz Selbmann, Mario Baum, et al. · Current Directions in Biomedical Engineering · 3
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(Invited) Parylene C Based Adhesive Bonding on 6” and 8” Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
2020 · Franz Selbmann, Mario Baum, et al. · ECS Transactions · 3
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Solid-State pH Sensors for Mine Water Monitoring
2020 · Frederic Güth, Franz Selbmann, et al. · ECS Meeting Abstracts · 2
Lignin Hydrogels as a Use Case for a New Miniaturized Chemical Sensing Platform Based on Suspended Gate Field Effect Transistors
2024 · Marieke Stapf, Vladislav Komenko, et al. · Advanced Sensor Research · 1
Fabrication and Integration of Quantum Dot Based Emitters for Smart Mechanical Watches
2023 · Joern Langenickel, Franz Selbmann, et al. · 1
Hollow Microneedle Fabrication and Characterization for Interstitial Fluid Extraction in Minimally Invasive Sensors
2023 · Tom Enderlein, Andreas Morschhauser, et al. · 1
A Parylene-Based Ultra-Thin Printed Circuit Board As a New Platform for Flexible Sensors and Wearables
2022 · Franz Selbmann, Frank Roscher, et al. · ECS Meeting Abstracts · 1
Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices
2022 · Matthias Fettke, Timo Kubsch, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 1
P8.4 - Herstellung und Charakterisierung von flexiblen potentiometrischen pH-Sensoren auf Parylene C Substraten
2021 · F. Selbmann, F. Güth, et al. · Poster · 1
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Works count: 50
Citation count: 198
H-index: 7
I10-index: 7
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