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Douglas E. Wallace

Observed name: Douglas Wallace
ORCID: 0009-0008-8891-3889
Observed ORCID: 0009-0008-8891-3889
OpenAlex ID: A5006098096
ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design
2023 · Hyunsu Chae, Keren Zhu, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 18
Simulation challenges in designing high speed serial links
2012 · Arun Reddy Chada, Bhyrav Mutnury, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design
2023 · Hyunsu Chae, Bhyrav Mutnury, et al. · Design, Automation, and Test in Europe · 4
ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning
2024 · Hyunsu Chae, Keren Zhu, et al. · Asia and South Pacific Design Automation Conference (ASP-DAC)
Method of Exploring HVM Process Corner Cases for Loss and Impedance in High Speed Designs
2023 · Hyunsu Chae, David Z. Pan, et al. · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Time-domain convolution method for pad signal from pin signal measurement
2010 · Douglas E. Wallace · IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Works count: 6
Citation count: 35
H-index: 3
I10-index: 2
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