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Andy Dai

Observed name: A. Dai
ORCID: 0000-0002-3602-6072
Observed ORCID: 0000-0002-3602-6072
OpenAlex ID: A5006223171
Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles
2014 · Y. Wang, S. Jones, et al. · Microelectronics Reliability · 63
Silver sintering die attach process for IGBT power module production
2017 · Yimin Zhao, Paul Mumby-Croft, et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · 28
Seismic attenuation tomography in southwestern China: Insight into the evolution of crustal flow in the Tibetan Plateau
2020 · Andy Dai, Chi-Chia Tang, et al. · Tectonophysics · 25
High temperature polyimide polymer material for high voltage IGBT power module switching applications
2018 · Muhammad Morshed, Ariful Islam, et al. · European Conference on Power Electronics and Applications · 4
Novel Technique to Reduce Substrate Tilt & Improve Bondline Control between AlN Substrate and AlSiC Baseplate in IGBT Modules
2016 · James C. Booth, Karthik Vijay, et al. · 2
Improved performance of new fast recovery high voltage diode chip set of 3.3kV and 6.5kV
2018 · Ariful Islam, L. Coulbeck, et al. · European Conference on Power Electronics and Applications · 1
Study of failure mechanism in the modern IGBT with a highly doped N-buffer layer
2014 · Chunlin Zhu, Ian Deviny, et al. · Annual Conference of the IEEE Industrial Electronics Society (IECON) · 1
Novel Technique to Reduce Substrate Tilt & Improve Bondline Control Between AlN Substrate and AlSiC Baseplate in IGBT Modules
2021 · Karthik Vijay, James Booth, et al. · Regional Events
Control of Partial Discharge with High Temperature Insulating Polymer for High Voltage IGBT Module Application
2018 · Muhammad Morshed, Ariful Islam, et al.
Works count: 9
Citation count: 124
H-index: 4
I10-index: 3
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