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Roy H. Campbell

Observed names: Campbell, Roy H, Campbell, Roy H., Campbell, Roy Harold, Campbell, Roy Harold author., R. K. Campbell, Roy Campbell, Roy Harold Campbell
OpenAlex ID: A5006268017
R-OSGi: Distributed Applications Through Software Modularization
2007 · Rellermeyer, Jan S., Alonso, Gustavo, et al. · 186
Where did my 256 GB go? A Measurement Analysis of Storage Consumption on Smart Mobile Devices
2021 · Ashish Bijlani, Umakishore Ramachandran, et al. · Proceedings of the ACM on Measurement and Analysis of Computing Systems · 8
Assured Cloud Computing
2018 · Campbell, Roy Harold, Kamhoua, Charles A., et al. · Wiley eBooks · 5
A Tool-Work-Thermocouple Compensating Circuit
1958 · K. J. Trigger, R. K. Campbell, et al. · Transactions of the American Society of Mechanical Engineers · 4
Where did my 256 GB go? A Measurement Analysis of Storage Consumption on Smart Mobile Devices
2021 · Ashish Bijlani, Umakishore Ramachandran, et al. · ACM SIGMETRICS Performance Evaluation Review · 1
Adversarial use of protein language models for modeling escape
2025 · Sayantani B. Littlefield, Roy H. Campbell · Annual Computer Security Applications Conference Workshops (ACSAC Workshops)
Workshop report—flexibility in system software
1994 · Helen A. Klein, Przemyslaw Pardyak, et al. · ACM SIGPLAN OOPS Messenger
PDF
Closure to “Discussion of ‘A Tool-Work-Thermocouple Compensating Circuit’” (1958, Trans. ASME, 80, p. 306)
1958 · K. J. Trigger, R. K. Campbell, et al. · Transactions of the American Society of Mechanical Engineers
Works count: 120
Citation count: 210
H-index: 4
I10-index: 1
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