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Mesut İnaç

Observed names: Inac, Mesut, Inaç, Mesut, Mesut Inac, İnaç, Mesut
ORCID: 0000-0002-1323-9331
Observed ORCID: 0000-0002-1323-9331
OpenAlex ID: A5006858893
Performance Comparison of Broadband Traveling Wave Amplifiers in 130-nm SiGe:C SG13G2 and SG13G3 BiCMOS Technologies
2021 · Mesut Inac, Adel Fatemi, et al. · IEEE Microwave and Wireless Components Letters · 18
Monolithically Integrated Optoelectronic Transmitter based on Segmented Mach-Zehnder Modulator in EPIC 250 nm BiCMOS Technology
2023 · Festim Iseini, Mesut Inac, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 17
The metal-insulator-metal diodes for infrared energy harvesting and detection applications
2016 · Elif G. Arsoy, Mesut Inac, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11
BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications
2017 · Mesut Inac, Matthias Wietstruck, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9
Lumped Ultra-Broadband Linear Driver in 130 nm SiGe SG13G3 Technology
2022 · Festim Iseini, Andrea Malignaggi, et al. · IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) · 8
Device characteristics of antenna-coupled metal-insulator-metal diodes (rectenna) using Al2O3, TiO2, and Cr2O3as insulator layer for energy harvesting applications
2015 · Mesut Inac, Atia Shafique, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
Model, design, and fabrication of antenna coupled metal-insulator-metal diodes for IR sensing
2015 · Mesut Inac, Atia Shafique, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Micro-Transfer Printing of SiGe BiCMOS Electronic Chiplets on Silicon
2026 · He Li, Tinus Pannier, et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2
Tunable and Highly Power Efficient Traveling Wave Amplifier in SiGe BiCMOS for Optical Modulators
2023 · Mesut Inac, Falk Korndoerfer, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 2
200 mm Wafer level graphene transfer by wafer bonding technique
2017 · Mesut Inac, Grzegorz Lupina, et al. · European Solid-State Device Research Conference · 2
Bread-board demonstration of a monolithically integrated coherent receiver for 100 Gb/s optical inter-satellite links
2023 · Ahmed Osman, Leontios Stampoulidis, et al. · IEEE International Conference on Space Optical Systems and Applications (ICSOS) · 1
Analysis and Implementation of DC-coupled Compact and Power Efficient Lumped Driver for Single-Ended Optical Modulators in SiGe 250 nm BiCMOS Technology
2023 · Festim Iseini, Andrea Malignaggi, et al. · IEEE International Symposium on Circuits and Systems proceedings · 1
A 128 Gb/s 7-Tap FIR Filter in 130 nm SiGe BiCMOS for High-Speed Channel Equalization
2022 · Mesut Inac, Anna Peczek, et al. · IEEE Microwave and Wireless Technology Letters · 1
Inductorless 96 Gb/s PAM-4 Optical Modulators Driver in SiGe:C BiCMOS
2022 · Mesut Inac, Anna Peczek, et al. · European Microwave Integrated Circuits Conference · 1
Compact and Transfer Printable 64 Gb/s Differential Transimpedance Amplifier in 130-nm BiCMOS
2021 · Mesut İnaç, Adel Fatemi, et al. · European Microwave Integrated Circuits Conference · 1
Fully Integrated 250−310 GHz Transmitter and Receiver in an Advanced SiGe BiCMOS Technology
2026 · Ahmed Gadallah, Mesut Inac, et al. · European Microwave Integrated Circuits Conference
High frequency characterization and modelling of RRAM devices integrated in CMOS process
2026 · Max Uhlmann, Seyyid Dilek, et al. · Solid-State Electronics
60 Gb/s Transimpedance Amplifiers with Emitter-Follower and Folded-Cascode Interstage Configurations in 22-nm FDSOI
2025 · Mesut Inac, Volkan Erturk, et al. · Asia-Pacific Microwave Conference (APMC)
Wafer-level packaging of photonics and electronics for terabit-scale optical interconnects
2019 · Paraskevas Bakopoulos, Peter Ossieur, et al. · Ghent University Academic Bibliography (Ghent University)
The Effect of Surface Optimization on Post-grinding Yield of 200 mm Wafer Level Packaging Applications
2018 · Mesut Inac, Matthias Wietstruck, et al. · Electronic System-Integration Technology Conference (ESTC)
BiCMOS Embedded Microfluidic Technology Based on Wafer Bonding Techniques for Biosensor Applications
2017 · Inac, Mesut, Wietstruck, Matthias, et al. · HAL
BiCMOS embedded microfluidic technology based on wafer bonding techniques for biosensor applications (BiCMOS eingebettete mikrofluidiktechnologie basierend auf wafer-bonding-techniken für biosensor-anwendungen)
2017 · Inac, Mesut, Wietstruck, Matthias, et al. · Sabanci University
Modeling, design and fabrication of metal-insulator-metal diodes as rectenna element for infrared energy harvesting and detection applications
2015 · Mesut İnaç · Sabanci University
Works count: 27
Citation count: 83
H-index: 5
I10-index: 3
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