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Anna A. Dedkova

Observed names: A A Dedkova, A. A. Dedkova, A. DEDKOVA, A. Dedkova, A.A. Dedkova, Anna Dedkova, Dedkova A. A., Dedkova A.A., Dedkova Anna A., Dedkova, Anna A., А. А. ДЕДКОВА, А. А. Дедкова, А.А. Dedkova, А.А. ДЕДКОВА, А.А. Дедкова
ORCID: 0000-0002-0616-2145
Observed ORCID: 0000-0002-0616-2145
OpenAlex ID: A5007025516
A study of preparation techniques and properties of bulk nanocomposites based on aqueous albumin dispersion
2013 · A. Yu. Gerasimenko, A. A. Dedkova, et al. · Optics and Spectroscopy · 16
Technique for Analyzing Volumetric Defects Using Digital Elevation Model of a Surface
2021 · A. A. Dedkova, I. V. Florinsky, et al. · Russian Journal of Nondestructive Testing · 12
Influence of the Degree of Crystallinity on the Dispersion of the Optical Parameters of Ge2Sb2Te5 Phase-Change Memory Thin Films
2020 · M. E. Fedyanina, P. I. Lazarenko, et al. · Semiconductors · 12
Experimental Determination of Mechanical Properties of the Anode Cell of an X-Ray Lithograph
2020 · N. A. Djuzhev, E. E. Gusev, et al. · Technical Physics · 12
Fast Nondestructive Technique for Analyzing Deflection of Membranes Located on the Substrate
2020 · A. A. Dedkova, N. A. Dyuzhev, et al. · Russian Journal of Nondestructive Testing · 11
Approaches to determining curvature of wafers by their topography
2021 · Anna A. Dedkova, Igor V. Florinsky, et al. · Physics-Uspekhi · 10
Mechanical Stresses Analysis of Thin Round Membranes in the Case of Large Deflections
2020 · Anna A. Dedkova, Petr Yu. Glagolev, et al. · IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering · 9
The Effect of Ion Beam Etching on Mechanical Strength Multilayer Aluminum Membranes
2019 · Evgeney E. Gusev, Anna V. Borisova, et al. · IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering · 9
Dependence of Mechanical Stresses in Silicon Nitride Films on the Mode of Plasma-Enhanced Chemical Vapor Deposition
2018 · A. V. Novak, V. R. Novak, et al. · Semiconductors · 9
Development and study of a conceptual model of an X-ray source with a field emission cathode
2017 · N. A. Djuzhev, M. A. Makhiboroda, et al. · Journal of Surface Investigation X-ray Synchrotron and Neutron Techniques · 9
Geomorphometry and microelectronic metrology: Converged realms
2023 · A. A. Dedkova, I. V. Florinsky · Transactions in GIS · 8
Investigating Mechanical Strength of Multilayer Membranes for MEMS Converters of Physical Quantities
2018 · Gusev Evgeniy E., Dedkova Anna A., et al. · Nanoindustry Russia · 8
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Approaches to determining curvature of wafers by their topography
2021 · Anna A. Dedkova, Igor V. Florinsky, et al. · Uspekhi Fizicheskih Nauk · 7
Investigation of Gallium Nitride Island Films on Sapphire Substrates Via Scanning Electron Microscopy and Spectral Ellipsometry
2019 · A. A. Dedkova, M. O. Nikiforov, et al. · Nanotechnologies in Russia · 7
Fabrication and Study of Parameters and Properties of Nanostructured Membranes for MEMS Devices
2017 · N. A. Dyuzhev, E. E. Gusev, et al. · Nanotechnologies in Russia · 7
Особенности деформирования круглых тонкопленочных мембран и экспериментальное определение их эффективных характеристик
2021 · А.А. Дедкова, П.Ю. Глаголев, et al. · Журнал технической физики · 6
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Stimulated Raman Scattering in Metal-Dielectric Nanocomposites with Spectrally Degenerate Dielectric Constant
2019 · M. D. Tyugaev, A. V. Kharitonov, et al. · Journal of Experimental and Theoretical Physics Letters · 6
Non-Contact Technique for Determining the Mechanical Stress in thin Films on Wafers by Profiler
2017 · N A Djuzhev, A A Dedkova, et al. · IOP Conference Series Materials Science and Engineering · 6
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Dependence of Mechanical Stress in Silicon Nitride Films on Conditions of Plasma-Enhanced Chemical Vapor Deposition
2017 · A.V. Novak, V.R. Novak, et al. · Proceedings of Universities ELECTRONICS · 6
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Techniques for analyzing digital elevation models of surface topography of microelectronics objects
2022 · Anna Dedkova, Igor Florinsky, et al. · International Conference on Micro- and Nano-Electronics (ICMNE) · 5
XVII Межгосударственная конференция Термоэлектрики и их применения --- 2021" (ISCTA 2021 Санкт-Петербург, 13-16 сентября, 2021 Получение и исследование омических контактов с высокой адгезией к термоэлементам
2021 · М.Ю. Штерн, А.О. Козлов, et al. · Физика и техника полупроводников · 5
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Оперативная неразрушающая методика анализа прогиба мембран, расположенных на пластине
2020 · А.А. Дедкова, Н.А. Дюжев, et al. · Дефектоскопия · 5
Formation and Properties of Nickel Contacts to Thermoelectric Materials Based on Bismuth and Antimony Chalcogenides
2022 · E. P. Korchagin, M. Yu. Shtern, et al. · Russian Journal of Applied Chemistry · 4
Technique for investigation of the shape changes of wafers and thin-film membranes by using geomorphometric approaches
2022 · Dedkova A. A., Florinsky I. V., et al. · Журнал технической физики · 4
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Development of Adhesive Wafer Bonding Technology
2021 · Michael Yu. Fomichev, Maksim A. Makhiboroda, et al. · IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering · 4
Works count: 66
Citation count: 251
H-index: 9
I10-index: 6
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