Author

Jeff Kennedy

Observed names: J. Kennedy, Jeffery Kennedy

Observed institutions: BAE Systems (United States), Manufacturing Technologies Association, Celestica (Brasil)

OpenAlex ID: A5007838167

Whisker Formation on SAC305 Soldered Assemblies

2014 · S. Meschter, P. Snugovsky, et al. · JOM · 21

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Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

2019 · André M. Delhaise, Polina Snugovsky, et al. · Journal of Electronic Materials · 19

Tin Whisker Growth on Electronic Assemblies Soldered with Bi-Containing, Pb-Free Alloys

2020 · André M. Delhaise, Zohreh Bagheri, et al. · Journal of Electronic Materials · 14

Plastic Ball-Grid-Arrays (PBGA): Are they ready for environmentally harsh Aerospace applications?

2002 · R. Guha, D. Humphrey, et al. · SAE technical papers on CD-ROM/SAE technical paper series · 9

A study of solder paste printing requirements for CSP technology

2000 · Jeff Kennedy · Soldering and Surface Mount Technology · 5

Laminate Based Substrates in Semiconductor Packages

1995 · Michael Freda, Jeff Kennedy · SPIE eBooks · 3

Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis

2020 · André M. Delhaise, Stephan Meschter, et al. · Journal of Surface Mount Technology · 1

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Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms

2021 · André M. Delhaise, Stephan Meschter, et al. · Journal of Surface Mount Technology

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Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I: Whisker Inspection Results

2019 · André M. Delhaise, Stephan Meschter, et al. · Journal of Surface Mount Technology

Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys

2019 · André M. Delhaise, David Hillman, et al. · Journal of Surface Mount Technology

Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints after Accelerated Reliability Testing Using a Thermal Treatment

2018 · André M. Delhaise, Mikaella Brillantes, et al. · SMTA International

Evaluation of Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage

2018 · André M. Delhaise, Stephan Meschter, et al. · Soldering and Reliability Conferences

Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys

2018 · André M. Delhaise, Polina Snugovsky, et al. · Journal of Surface Mount Technology

Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys

2017 · André M. Delhaise, Polina Snugovsky, et al. · Soldering and Reliability Conferences

REMAP Materials Project M2: High Temperature High Humidity Corrosion and Tin Whisker Evaluation of Bi Containing Lead-Free Alloys

2016 · Polina Snugovsky, Stephan Meschter, et al. · Soldering and Reliability Conferences

Strategic Environmental Research and Development Program (SERDP) Layered Nanoparticle Enhanced Conformal Coating for Whisker Mitigation

2016 · S. Meschter, J. Cho, et al. · Soldering and Reliability Conferences

Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating Project: Coating Modeling for Tin Whisker Mitigation

2015 · S. McKeown, S. Meschter, et al. · SMTA International

Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Long Term Low Temperature High Humidity Testing

2015 · Stephan Meschter, Evan Ekstrom, et al. · Soldering and Reliability Conferences

Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies

2014 · Stephan Meschter, Polina Snugovsky, et al. · SMTA International

Strategic Environmental Research and Development Program (SERDP) Nanoparticle Enhanced Conformal Coating for Whisker Mitigation

2014 · S. Meschter, J. Cho, et al. · SMTA International

Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation

2014 · Junghyun Cho, Stephan J. Meschter, et al. · Journal of Surface Mount Technology

Polyurethane Conformal Coatings Filled with Hard Nanoparticles for Tin Whisker Mitigation

2014 · Junghyun Cho, Stephan J. Meschter, et al. · Soldering and Reliability Conferences

SERDP Tin Whisker Testing and Modeling: Simplified Whisker Risk Model Development

2014 · Stephen A. McKeown, Stephan J. Meschter, et al. · Soldering and Reliability Conferences

Strategic Environmental Research and Development Program (SERDP) Tin Whisker Testing and Modeling: Thermal Cycling Testing

2014 · Stephan Meschter, Polina Snugovsky, et al. · Soldering and Reliability Conferences

NASA DoD Phase 2: SAC305 and SN100C Copper Dissolution Testing

2013 · Jeff Kennedy, Dave Hillman, et al. · Soldering and Reliability Conferences

Works count: 32

Citation count: 72

H-index: 5

I10-index: 3