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Emre Can Durmaz

Observed names: Dumaz, Emre Can, E. C. Durmaz, E.C. Durmaz, Emre C. Durmaz
ORCID: 0009-0002-4696-0720
Observed ORCID: 0009-0002-4696-0720
OpenAlex ID: A5008217942
Highly Sensitive Capacitive Sensor Based on Injection Locked Oscillators with ppm Sensing Resolution
2020 · Meissa Babay, Clement Hallepee, et al. · IEEE MTT-S International Microwave Symposium digest · 9
Design of monocrystalline Si/SiGe multi-quantum well microbolometer detector for infrared imaging systems
2016 · Atia Shafique, Emre C. Durmaz, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6
SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications
2023 · Emre Can Durmaz, Carl Heine, et al. · IEEE International D Systems Integration Conference · 3
Thermo-Mechanical Modeling and Experimental Validation of an Uncooled Microbolometer
2020 · C. Baristiran Kaynak, A. Goeritz, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 3
The Assembly Investigation of a Multichip to PCB Flip-Chip Package Using Cu Pillar Bumps
2024 · Zhibo Cao, Jens Lehmann, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2
Towards a fully integrated sub-THz microfluidic sensor platform for dielectric spectroscopy
2022 · Carl Heine, Emre Can Durmaz, et al. · Frequenz · 2
A low-power CMOS readout IC design for bolometer applications
2017 · Arman Galioglu, Shahbaz Abbasi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
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Design and Implementation of Injection Locked Oscillator Biosensors
2019 · M. Babay, C. Dalmay, et al. · European Microwave Conference (EuMC) · 1
Silicon Interposer with Advanced RF Technology Modules for BiCMOS Wafer-Level Packaging
2026 · Matthias Wietstruck, Patrick Krüger, et al. · German Microwave Conference
Low-Loss D-Band Flip-Chip Interconnects Based on Au–Au Bonded Copper Pillars
2026 · Emre Can Durmaz, Carl Heine, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology
SiGe BiCMOS Wafer-level Packaging and Antenna Integration for sub-THz Applications
2025 · Matthias Wietstruck, Sebastian Schulze, et al. · German Microwave Conference
Advancements in the Cu Pillar Based PCB Microfluidic System Integration with SiGe BiCMOS Technology
2024 · Emre Can Durmaz, Carl Heine, et al. · Smart Systems Integration Conference and Exhibition (SSI)
Potentialités d’architectures de biocapteurs basées sur des oscillateurs hyperfréquences verrouillés par injection
2019 · Babay, Meissa, Dalmay, Claire, et al. · HAL
Lab-On-A -Chip For Cellular Analysis By Dielectric Spectroscopy Based On Injection Locked Oscillators
2019 · Babay, Meissa, Dalmay, Claire, et al. · HAL
HfO2, Al2O3, and ZnO based Metal-Insulator-Metal photovoltaic structures for solar cell applications
2018 · Emre Can Durmaz · Sabanci University
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Highly efficient MIM diodes for NIR and SWIR applications
2018 · Elif Gul Arsoy, Emre Can Durmaz, et al.
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Array size and area impact on nanorectenna performance properties
2017 · Elif Gul Arsoy, Emre Can Durmaz, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
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Works count: 17
Citation count: 28
H-index: 3
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