Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Thomas Plach
Observed name:
T. Plach
Institution:
EV Group (Austria)
Observed institutions:
Johannes Kepler University of Linz,
Gyeongju University,
Yıldız Technical University,
EV Group (Austria),
Research Center for Non Destructive Testing (Austria),
Indian Institute of Science Bangalore
show all 6
OpenAlex ID:
A5009322218
Mechanisms for room temperature direct wafer bonding
2013
·
T. Plach
, K. Hingerl
, et al.
·
Journal of Applied Physics
·
204
A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
2023
·
Serena Iacovo
, Koen D'havé
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
29
Interdiffusion in Heusler film epitaxy on GaAs(001)
2011
·
C. Gusenbauer
, T. Ashraf
, et al.
·
Physical Review B
·
25
Dielectric Function of Undoped and Doped Poly[2-methoxy-5-(3′,7′-dimethyloctyloxy)-1,4-phenylene-vinylene] by Ellipsometry in a Wide Spectral Range
2013
·
Jacek Gasiorowski
, Kurt Hingerl
, et al.
·
The Journal of Physical Chemistry C
·
22
PDF
Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers
2024
·
Shuo Kang
, Serena Iacovo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
21
Cu-Cu wafer bonding: An enabling technology for three-dimensional integration
2014
·
B. Rebhan
, T. Plach
, et al.
·
International Conference on Electronics Packaging (ICEP)
·
16
High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing
2016
·
Florian Kurz
, Thomas Plach
, et al.
·
ECS Transactions
·
14
Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding
2024
·
Richard J. F. van Haren
, Suwen Li
, et al.
·
SPIE Novel Patterning Technologies
·
13
Plasma Activation for Low Temperature Wafer Bonding
2008
·
Thomas Plach
, Viorel Dragoi
, et al.
·
ECS Transactions
·
13
Synthesis of visible light emitting self assembled Ge nanocrystals embedded within a SiO2 matrix
2012
·
A. Hernández-Hernández
, V. T. Rangel-Kuoppa
, et al.
·
Journal of Applied Physics
·
12
Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations
2023
·
Richard J. F. van Haren
, Suwen Li
, et al.
·
Metrology, Inspection, and Process Control XXXVI
·
11
Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches
2024
·
Karine Abadie
, Ivanie Mendes
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
10
Multiphysics Overlay Modelling of Monolithic 3D Fusion and Hybrid Bonding Processes
2024
·
Christian Mühlstätter
, Lukas Koller
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Investigations on Bond Strength Development of Plasma Activated Direct Wafer Bonding with Annealing
2013
·
Thomas Plach
, Kurt Hingerl
, et al.
·
ECS Transactions
·
9
PDF
(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
2018
·
Thomas Plach
, Bernhard Rebhan
, et al.
·
ECS Transactions
·
7
PDF
Wafer-to-Wafer Bonding with Saddle-Shaped Wafers
2025
·
Shuo Kang
, Serena Iacovo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion
2023
·
Laurent Gaëtan Michaud
, Frank Fournel
, et al.
·
ECS Transactions
·
4
Key enabling processes for more-than-moore technologies
2012
·
P. Lindner
, T. Glinsner
, et al.
·
IEEE International SOI Conference (SOI)
·
4
Silicon direct bonding
2020
·
Thomas Plach
, Kimmo Henttinen
, et al.
·
Elsevier eBooks
·
3
Influencing factors in high precision fusion wafer bonding for monolithic integration
2015
·
Thomas Uhrmann
, Florian Kurz
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Temperature dependent transport study of the SiO[sub x]∕Ge∕SiO[sub x] system
2013
·
Victor-Tapio Rangel-Kuoppa
, Thomas Plach
, et al.
·
AIP conference proceedings
·
3
(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
2018
·
Thomas Plach
, Bernhard Rebhan
, et al.
·
ECS Meeting Abstracts
·
2
Synthesis of Light Emitting Ge Nanocrystals by Reactive RF Sputtering
2011
·
Arturo Hernandez-Hernandez
, Victor Tapio Rangel-Kuoppa
, et al.
·
Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena
·
2
Wafer-to-Wafer Bonding for Advanced Manufacturing Nodes
2024
·
Thomas Plach
, Anton Alexeev
, et al.
·
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
·
1
Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion
2023
·
Laurent Gaëtan Michaud
, Frank Fournel
, et al.
·
ECS Meeting Abstracts
·
1
Show more works
View as search
Works count:
40
Citation count:
448
H-index:
11
I10-index:
12
Year
Topic
Type
