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Author

Amares Singh

Observed names: Amares SINGH, Singh Amares
Institution: Taylor's University
Observed institutions: Multimedia University, Taylor's University, Universiti Tunku Abdul Rahman Sungai Long Campus, UCSI University, SEGi University, Universiti Tunku Abdul Rahman
ORCID: 0000-0002-4368-302X
Observed ORCID: 0000-0002-4368-302X
OpenAlex ID: A5009426807
Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys
2014 · Ervina Efzan Mhd Noor, Amares Singh · Soldering and Surface Mount Technology · 63
A review: influence of nano particles reinforced on solder alloy
2013 · Ervina Efzan Mhd Noor, Amares Singh, et al. · Soldering and Surface Mount Technology · 49
Effect of Mo and ZrO2 nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint
2024 · Amares SINGH, Hui Leng CHOO, et al. · Transactions of Nonferrous Metals Society of China · 15
Study on Hardness and Shear Strength with Microstructure Properties of Sn52Bi/Cu + 1% Al2O3 Nanoparticles
2020 · Amares Singh, Rajkumar Durairaj · IOP Conference Series Materials Science and Engineering · 13
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A Review: Effect of Nanoparticle Additions on the Physical, Microstructural, Interfacial and Mechanical Properties of Low Temperature SnBi Solder Alloys
2025 · Amares Singh, Hui Leng Choo, et al. · JOM · 9
Effect on Shear Strength and Hardness Properties of Tin Based Solder Alloy, Sn-50Bi, Sn-50Bi+2%TiO2 Nanoparticles
2020 · Singh Amares, Bandar Tchari · Advanced materials research · 9
A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy
2015 · Amares Singh, Ervina Efzan Mhd.Noor · MATEC Web of Conferences · 6
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Characterization of mechanical testing on lead free solder on electronic application
2012 · Efzan M.N. Ervina, Amares Singh · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 6
Green Composites Reinforced with Natural Fibers: A Review on Mechanical Properties
2022 · Shamini Janasekaran, Zhou Lei, et al. · Advanced structured materials · 3
Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy
2020 · Amares Singh, Rajkumar Durairaj, et al. · Journal of Advanced Research in Fluid Mechanics and Thermal Sciences · 3
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Investigation on the Thermal and Wettability Properties Aided with Mechanical Test Simulation of Tin (Sn) - Bismuth (Bi) Solder Alloy at Low Reflow Temperatures
2024 · Noor Elyna Ezette Anuar, Amares Singh, et al. · Key engineering materials · 2
Development and Analysis of an Optimized Heat Source Model for Wire Arc Additive Manufacturing Using Numerical Simulation
2024 · Noridzwan Nordin, Hui Leng Choo, et al. · International Conference on Robotics, Engineering, Science, and Technology (RESTCON) · 2
Electric Discharge Drilling of Ti-6Al-4 V with O2 as Dielectric Medium
2022 · N. Pragadish, Elango Natarajan, et al. · Lecture notes in mechanical engineering · 2
Effect on the wettability, hardness and shear strength properties of 3%-nano Titanium Oxide (TiO2) added Sn-3.8Ag-0.7Cu (SAC)/Copper (Cu) solder joint
2018 · Amares Singh, Rajkumar Durairaj · MATEC Web of Conferences · 2
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Reliability Study of Lead Free Sn-3.8Ag-0.7Cu and Copper (Cu) Substrate based on the Microstructure, Physical and Mechanical Properties / Amares Singh...[et al.]
2018 · Amares Singh, R. Durairaj, et al. · Siti Hasmah Digital Library-MMU Institutiona Repository (Multimedia University) · 2
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From discrete experiments to continuous design maps: Pareto and knee-band selection for ceramic microspheres/multi-walled carbon nanotubes epoxy composites
2026 · Bridjesh Pappula, Seshaiah Turaka, et al. · Materials Today Communications · 1
CFD Simulation On Solder Joints Wetting Properties For A Low And High Temperature Solder
2024 · Wee Tze Sheng, Amares Singh · Journal of Physics Conference Series · 1
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Impact of 3% Molybdenum(Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint
2022 · Amares Singh, Rajkumar Durairaj, et al. · IOP Conference Series Materials Science and Engineering · 1
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Thermal, wetting, and microstructural properties of the tin–bismuth (Sn–58Bi) solder joint at different reflow temperatures
2026 · Huzaifa Azam, Amares Singh, et al. · Journal of Materials Science Materials in Electronics
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Sound Transmission Loss Performance of Bio-composite Micro-perforated Panels Backed by Natural Fibers
2025 · Tan Wei Hong, Stephanie Yen Nee Kew, et al. · ASEAN Engineering Journal
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Effects of TiC and Cr on Microstructure and Performance of Ni60 Alloy Coatings
2025 · JianYong Guo, Siew Wei Phang, et al. · IEEE International Conference on Recent Advances and Innovations in Engineering (ICRAIE)
Effects of key parameters on aluminum alloy microhardness using friction stir welding
2025 · Shamini Janasekaran, Walisijiang Tayier, et al. · AIP conference proceedings
Review: Current Trends in Artificial Intelligence on Healthcare
2023 · Shamini Janasekaran, Anas Zeyad Yousef, et al. · SpringerBriefs in applied sciences and technology
Thermal, Microstructure, and Hardness Properties of Molybdenum Nanoparticles Added Tin -Bismuth Solder Alloy for Low-Temperature Soldering Application
2022 · Amares Singh, Rajkumar Durairaj, et al. · Lecture notes in mechanical engineering
Primary Study on the Effect of the 1% and 2% TiO2 Nanoparticles to the Microhardness, Microstructure and Contact Angle of the SnBi/Cu Solder Alloy
2021 · Amares Singh, R. Durairaj, et al. · Turkish Online Journal of Qualitative Inquiry
Works count: 27
Citation count: 198
H-index: 7
I10-index: 4
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