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Sanjay Tikale

Observed name: Tikale Sanjay
ORCID: 0000-0002-9332-7939
Observed ORCID: 0000-0002-9332-7939
OpenAlex ID: A5010428162
Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles
2020 · Sanjay Tikale, K. Narayan Prabhu · Materials Science and Engineering A · 52
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy
2020 · Sanjay Tikale, K. Narayan Prabhu · Microelectronics Reliability · 16
Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles
2018 · Sanjay Tikale, K. Narayan Prabhu · Transactions of the Indian Institute of Metals · 15
Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy
2018 · Sanjay Tikale, K. Narayan Prabhu · Journal of Materials Engineering and Performance · 15
Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate
2021 · Sanjay Tikale, K. Narayan Prabhu · Journal of Materials Science Materials in Electronics · 13
Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions
2022 · K. Georgy, Sanjay Tikale, et al. · Materials Science and Technology · 9
Effect of Multiple Reflow Cycles on the Shear Strength of Nano-Al2O3 Particles Reinforced Sn3.6Ag Lead-Free Solder Alloy
2018 · Sanjay Tikale, K. Narayan Prabhu · Transactions of the Indian Institute of Metals · 6
Assessment of the Performance of Sn–3.5Ag/Cu Solder Joint Under Multiple Reflows, Thermal Cycling and Corrosive Environment
2018 · Augustine Samuel, Sanjay Tikale, et al. · Transactions of the Indian Institute of Metals · 4
Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate
2015 · Sanjay Tikale, Mrunali Sona, et al. · Materials science forum · 4
The Effect of Reflow Temperature on Time at the End of Gravity Zone (Tgz) of Sn-3.8Ag-0.7Cu Solder Alloy
2020 · Ramanandan Santhanu Panikar, V. Amogha Skanda, et al. · Materials Performance and Characterization · 3
The Effect of Multi-Walled Carbon Nanotubes Reinforcement and Multiple Reflow Cycles on Shear Strength of SAC305 Lead-Free Solder Alloy
2019 · Sanjay Tikale, K. Narayan Prabhu · Materials Performance and Characterization · 2
Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates
2019 · Mrunali Sona, Sanjay Tikale, et al. · Transactions of the Indian Institute of Metals · 2
Effect of Cooling Rate on Joint Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate
2017 · Sanjay Tikale, Mrunali Sona, et al. · Materials Performance and Characterization · 1
Al_2O_3ナノ粒子を用いた低銀含有量SAC0307はんだ合金の開発【JST・京大機械翻訳】
2020 · Tikale Sanjay, Prabhu K. Narayan · Materials Science and Engineering A
Works count: 14
Citation count: 142
H-index: 6
I10-index: 5
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