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Chengshiun Liou
Observed names:
Cheng-Shiun Liou,
Liou Chengshiun
Institution:
Feng Chia University
Observed institution:
Feng Chia University
ORCID:
0000-0002-2377-7432
Observed ORCID:
0000-0002-2377-7432
OpenAlex ID:
A5011372594
Micro-Cantilever Array With Electroplating Tin Bumps for Flip-Chip Bonding Technology
2023
·
Zihsong Hu
, Chengshiun Liou
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
9
The Implementation of Sapphire Microreflector for Monolithic Micro-LED Array
2021
·
Chengshiun Liou
, Fuchi Shih
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
7
A study of the effect of different coplanar dual-coil geometries on the performance of mutual inductance
2017
·
Siansyun Liao
, Weichen Li
, et al.
·
Sensors and Actuators A Physical
·
7
Design and Fabrication of Micro-LED Display with Sapphire Micro-Reflector Array
2020
·
Chengshiun Liou
, Mingyu Hsieh
, et al.
·
IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
·
5
Compact Dual-LED Packaging With a 3-D Free-Form Lens for Uniform Rectangular Illumination
2018
·
Chengshiun Liou
, Chingfu Tsou
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
5
A CMOS-MEMS Fluorescence Quenching Gas Sensor Encapsulated with Silicon-Based LED Reflector
2021
·
Ya-Chu Lee
, Shih-Wei Lin
, et al.
·
International Conference on Solid-State Sensors, Actuators and Microsystems
·
4
Monolithically GaN-Based Optocoupler With Chip Scaling
2023
·
Chengshiun Liou
, Chingfu Tsou
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
3
Monolithic Integration of GaN-based Optocoupler
2022
·
Chengshiun Liou
, Chingfu Tsou
·
IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)
·
2
Integration and Encapsulation of Light-Emitting Diode and CMOS-MEMS Chips for Fluorescence Quenching Gas Sensor
2022
·
Ya-Chu Lee
, Cheng-Shiun Liou
, et al.
·
Frontiers in Mechanical Engineering
·
1
PDF
Monolithic Integration of GaN-Based Flexible Microcantilever for Opto-Electromechanical Force Sensing
2026
·
Pohsing Chiu
, Yuwei Chen
, et al.
·
IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
An Improved Monolithic GaN-Based Optocoupler With Annular Interdigitated Microstructures
2025
·
Jhihfong Liou
, Yuwei Chen
, et al.
·
IEEE Sensors Letters
Monolithic GaN-based Optocoupler with Annular Interdigitated Microstructures
2025
·
Shengyung Wang
, Jhihfong Liou
, et al.
·
International Conference on Optical MEMS and Nanophotonics
Silicon-based LED packaging module with a TiO2 capacitive temperature sensor
2017
·
Shihwei Lin
, Kenwei Tang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
A silicon-based dual-LED packaging module with a three-dimension freeform lens for square illumination
2016
·
Chengshiun Liou
, Chingfu Tsou
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
正方照明のための3次元自由形状レンズを用いた珪素に基づく二重LEDパッケージングモジュール【Powered by NICT】
2016
·
Liou Chengshiun
, Tsou Chingfu
·
IEEE Conference Proceedings
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Works count:
15
Citation count:
43
H-index:
5
I10-index:
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