Get started
Author

Mollie Benson

Institution: NXP (Germany)
Observed institutions: NXP (Germany), NXP (United States)
OpenAlex ID: A5011513196
Advanced Fan Out Wafer Level Package Development for Small form Factor and High-Performance Microcontroller Applications
2019 · Gaurav Sharma, Nishant Lakhera, et al. · International Wafer Level Packaging Conference (IWLPC) · 6
Solder-Joint Reliability of BGA Packages in Automotive Applications
2019 · Burton Carpenter, Andrew Mawer, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 4
Board Level Reliability of Automotive Grade WLCSP for Radar Applications
2020 · Nishant Lakhera, Burt Carpenter, et al. · International Wafer Level Packaging Conference (IWLPC) · 3
Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications
2021 · Andrew Mawer, Mollie Benson, et al. · Journal of Surface Mount Technology · 2
PDF
Cu Wirebond Technology in 16FFC High Performance Automotive Radar Processor with IR Drop Reduction Methodology
2022 · Jasmine Lim, Tu-Anh Tran, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Fan Out Wafer Level Package With Enhanced Product Reliability and Advanced Node Silicon Chip Package Integration
2024 · Gaurav Sharma, Nishant Lakhera, et al. · IMAPSource Proceedings
PDF
CU Wirebond Technology in 16FFC High Performance Automotive Radar Processor with IR Drop Reduction Methodology
2023 · Tu Anh Tran, Jasmine Lim, et al. · IMAPSource Proceedings
PDF
Board Level Reliability of Flipchip Package
2023 · Nishant Lakhera, Mollie Benson, et al. · IMAPSource Proceedings
PDF
Board Level Reliability of Automotive Grade WLCSP for Radar Applications
2022 · Nishant Lakhera, Burt Carpenter, et al. · Journal of Surface Mount Technology
PDF
Wafer Level Package Developments for High Performance, Enhanced Reliability Microcontroller Applications
2022 · Gaurav Sharma, Nishant Lakhera, et al. · Wafer-Level Packaging Symposium
Board Level Reliability of Automotive Grade WLCSP for Radar Applications
2020 · Nishant Lakhera, Burt Carpenter, et al. · Wafer-Level Packaging Symposium
Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications
2020 · Andrew Mawer, Mollie Benson, et al. · SMTA International
Advanced Fan Out Wafer Level Package Development for Small Form Factor and High-Performance Microcontroller Applications
2019 · Gaurav Sharma, Nishant Lakhera, et al. · Wafer-Level Packaging Symposium
Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving Applications
2018 · Mollie Benson, Burton Carpenter, et al. · IMAPSource Proceedings
Effect of Package Warpage and Composite Cte on Failure Modes in Board-Level Thermal Cycling
2018 · Andrew Mawer, Paul Galles, et al. · SMTA International
Solder-Joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive Applications
2018 · Burton Carpenter, Mollie Benson, et al. · SMTA International
Redesign of the Medtronic Kyphon Bone Cement Mixer for Vertebral Compression Fractures
2017 · Mollie Benson, Sarah Freesemann, et al. · DigitalCommons - CalPoly (California State Polytechnic University)
PDF
Works count: 17
Citation count: 16
H-index: 3
I10-index:
Year
Topic
Type