Author

Jiang Wu

2021 · Pan Wang, Xipeng Tan, et al. · Materials Science and Engineering A · 40
2024 · Zupeng Li, Ning Li, et al. · Journal of Colloid and Interface Science · 18
2010 · Jiang Wu, Thierry Grosdidier, et al. · Journal of Alloys and Compounds · 9
2007 · J.-F. Huang, Y. Huang, et al. · Materials Research Innovations · 8
2009 · J. Wu, S. Xing, et al. · WIT transactions on engineering sciences · 5
2021 · Jiang Wu, Eugene Choo · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
2025 · Zhiyuan Wang, Jiang Wu, et al. · IEEE MTT-S International Wireless Symposium (IWS) · 2
2010 · H. Y. He, J. F. Huang, et al. · International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) · 2
2008 · J. F. Huang, C. K. Xia, et al. · Materials Research Innovations · 2
2011 · Jiang Wu, Samuel Margueron, et al. · Advanced Engineering Materials · 1
2010 · J. F. Huang, J. R. Li, et al. · Materials Research Innovations · 1
2026 · Jiang Wu, Yiqing Wang, et al. · IEEE International Symposium on Circuits and Systems proceedings
2023 · Murong Zhuo, Jiang Wu, et al. · IEEE MTT-S International Wireless Symposium (IWS)
Works count: 26
Citation count: 280
H-index: 7
I10-index: 5
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