Author

Lingjie Tengxu

Observed name: Xulingjie Teng

Institution: University of Electronic Science and Technology of China

Observed institution: University of Electronic Science and Technology of China

ORCID: 0000-0002-0903-9695

Observed ORCID: 0000-0002-0903-9695

OpenAlex ID: A5011877535

1-(4-Hydroxyphenyl)-2 H -tetrazole-5-thione as a leveler for acid copper electroplating of microvia

2022 · Xulingjie Teng, Zhihua Tao, et al. · RSC Advances · 28

Evaluating the via filling performance with thin surface Cu by the synergistic effect of different additives

2022 · Zhihua Tao, Lingjie Tengxu, et al. · Thin Solid Films · 12

Evaluating copper plating process for filling micro vias with thin surface Cu by the 1-(4-carboxyphenyl)-5-mercapto-1H-tetrazole additive

2024 · Zewei. Lin, Xuefei Tao, et al. · Journal of Electroanalytical Chemistry · 3

Evaluating Copper Plating Process for Filling Micro Vias with Thin Surface Cu by the 1-(4-Carboxyphenyl)-5-Mercapto-1h-Tetrazole Additive

2024 · Zewei Lin, Xuefei Tao, et al. · SSRN Electronic Journal

Electrochemical corrosion behavior of steel in acid solution with some tetrazole derivative

2022 · Xulingjie Teng, Baohua Wu, et al. · CRC Press eBooks

Electrochemical evaluation myclobutanil as inhibitor for copper in nitric acid medium

2021 · Xuefei. Tao, Lingjie Tengxu, et al. · IOP Conference Series Earth and Environmental Science

Works count: 6

Citation count: 43

H-index: 3

I10-index: 2