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Sébastien Bérard-Bergery

Observed names: Bérard-Bergery, Sébastien, S. Berard-Bergery, S. Bérard-Bergery, Sebastien BERARD-BERGERY, Sebastien Berard-Bergery, Sébastien Berard-Bergery, Sébastien BÉRARD-BERGERY, Sébastien, Bérard-Bergery
Observed institutions: Centre National de la Recherche Scientifique, Arkema (France), Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, STMicroelectronics (France), Centre de Recherche sur l'Hétéro-Epitaxie et ses Applications, Laboratoire d'Électronique des Technologies de l'Information, Université Grenoble Alpes
OpenAlex ID: A5012967923
Growth of non-polar ZnO/(Zn,Mg)O quantum well structures on R-sapphire by plasma-assisted molecular beam epitaxy
2006 · J.-M. Chauveau, D.A. Buell, et al. · Journal of Crystal Growth · 43
Template affinity role in CH shrink by DSA planarization
2015 · R. Tiron, A. Gharbi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 19
Rigorous Model-Based Mask Data Preparation Algorithm Applied to Grayscale Lithography for the Patterning at the Micrometer Scale
2021 · Pierre Chevalier, Patrick Quemere, et al. · Journal of Microelectromechanical Systems · 15
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Matching of beams on the MAPPER MATRIX tool: a simulation study
2013 · J. Belledent, G. Z. M. Berglund, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9
Highlighting stochastics manifestations in 193nm immersion lithography with contour-based metrology metrics
2022 · Elvire Soltani, Bertrand Le-Gratiet, et al. · Metrology, Inspection, and Process Control XXXVI · 7
Tilted beam SEM, 3D metrology for industry
2019 · Charles Valade, Jérôme Hazart, et al. · Metrology, Inspection, and Process Control XXXVI · 7
Complete data preparation flow for Massively Parallel E-Beam lithography on 28nm node full-field design
2016 · Aurélien Fay, Clyde Browning, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
Tilted beam scanning electron microscopy, 3-D metrology for microelectronics industry
2019 · Charles Valade, Jérôme Hazart, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 6
Grayscale lithography process study for sub 5µm microlens patterns
2019 · Nacima Allouti, Chevalier Pierre, et al. · SPIE Novel Patterning Technologies · 6
High-spatial frequency on-device overlay characterization using CD-SEM contours
2023 · Thibaut Bourguignon, Bertrand Le Gratiet, et al. · Metrology, Inspection, and Process Control XXXVI · 4
Enabling on-device and target-free overlay measurement from CD-SEM contours
2022 · Thibaut Bourguignon, Regis Bouyssou, et al. · Metrology, Inspection, and Process Control XXXVI · 3
Model-based contour extraction: an enabler for very low-frame SEM images metrology
2022 · Elie Sezestre, Juline Scoarnec, et al. · Metrology, Inspection, and Process Control XXXVI · 3
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3D resist reflow compact model for imagers microlens shape optimization
2019 · Sébastien Bérard-Bergery, Jérôme Hazart, et al. · Design-Process-Technology Co-optimization for Manufacturability · 3
193i lithography for contact doubling with grapho-epitaxy DSA: a simulation study
2015 · A. Fouquet, L. Perraud, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Replication of 3D patterns from a grayscale resist master by nanoimprint process
2023 · Api Warsono, Diana Stephany Fernandez Rodas, et al. · SPIE Novel Patterning Technologies · 2
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Predicting DUV open contact risk with scarce sampling using new contour-based metrics
2022 · Elvire Soltani, Bertrand Le-Gratiet, et al. · European Mask and Lithography Conference (EMLC) · 2
Determining the validity domain of roughness measurements as a function of CD-SEM acquisition conditions
2021 · Mohamed Abaidi, Jordan Belissard, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 2
Beyond contrast curve approach: a grayscale model applied to sub-5µm patterns
2019 · Chevalier Pierre, Patrick Quéméré, et al. · SPIE Novel Patterning Technologies · 2
Process highlights to enhance DSA contact patterning performances
2016 · A. Gharbi, R. Tiron, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Rethinking mask strategies for high vertical resolution grayscale lithography
2024 · gaby bélot, Aurélien Fay, et al. · Photomask and next-generation lithography mask technology. Conference · 1
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Understanding the impact of rinse on SEM image distortion and hole patterning variability
2023 · Elvire Soltani, Bertrand LE-GRATIET, et al. · European Mask and Lithography Conference (EMLC) · 1
Mask errors impact on grayscale lithography patterning
2023 · Ujwol Palanchoke, Gaby Bélot, et al. · SPIE Novel Patterning Technologies · 1
Roughness measurement of 2D curvilinear patterns: challenges and advanced methodology
2021 · Jonathan Pradelles, Loïc Perraud, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 1
Progresses in 300mm DUV photolithography for the development of advanced silicon photonic devices
2015 · Charles Baudot, Bertrand Szelag, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
ArF grayscale lithography for high-volume manufacturing of submicron 3D structures
2026 · Gaby BÉLOT, Sébastien BÉRARD-BERGERY, et al. · Micro and Nano Engineering
Works count: 31
Citation count: 150
H-index: 7
I10-index: 3
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