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Hanno Melzner

Observed names: H. MELZNER, H. Melzner, Melzner Hanno, Melzner, Hanno
OpenAlex ID: A5013436499
Concurrent wire spreading, widening, and filling
2007 · Olivier Rizzo, Hanno Melzner · ACM/IEEE Design Automation Conference (DAC) · 11
Statistical modeling and analysis of wafer test fail counts
2003 · H. Melzner · ASMC proceedings · 9
Failure Rate Prediction and Accelerated Detection of Anomalous Charge Loss in Flash Memories by Using an Analytical Transient Physics-Based Charge Loss Model
2002 · Franz Schuler, Georg Tempel, et al. · Japanese Journal of Applied Physics · 9
Maximization of Good Chips Per Wafer by Optimization of Memory Redundancy
2007 · Hanno Melzner, Alexander Olbrich · IEEE Transactions on Semiconductor Manufacturing · 8
Evaluation of Ti and TiN thicknesses for tungsten plug contact metallization
1993 · H. Koerner, H.P. Erb, et al. · Applied Surface Science · 8
BEX-a novel wafer yield distribution model and analysis
2004 · H. Melzner, T. Darnhofer · ASMC proceedings · 6
Micromechanical Adhesion Experiments and Simulation on Cu-Damascene Processed Test Devices
2022 · W. Heyn, S. Ananiev, et al. · IEEE Transactions on Device and Materials Reliability · 4
In-situ SEM micromechanical experiments on Dual Damascene Copper test structures for investigation of interfacial properties of copper interconnects
2021 · Wieland Heyn, Hanno Melzner, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
Concurrent Wire Spreading, Widening, and Filling
2007 · Olivier Rizzo, Hanno Melzner · ACM/IEEE Design Automation Conference (DAC) · 3
Smaller is Better? Maximization of Good Chips per Wafer by Co-Optimization of Yield and Chip Area
2006 · H. Melzner · ASMC proceedings · 3
A Self Aligned Contact Process With Improved Surface Planarization
1988 · K. H. KÜSTERS, W. SESSELMANN, et al. · Le Journal de Physique Colloques · 3
Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading
2023 · W. Heyn, H. Melzner, et al. · Microelectronics Reliability · 2
A Yield Model Incorporating Random and Systematic Yield Part I: Theory
2008 · Hanno Melzner · ASMC proceedings · 2
A routing clean-up methodology for improvement of defect and lithography related yield
2008 · Jacques Herry, Reinhard März, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Critical Area Analysis of IC layout for automotive application
2016 · Ke Kian Seng Joseph, Tan Ban Heng, et al. · IEEE International Conference on Semiconductor Electronics · 1
Latent defect detection in microcontroller embedded flash test using device stress and wordline outlier screening
2014 · Andreas Kux, Rudolf Ullmann, et al. · IEEE International Test Conference (ITC) · 1
Navigating in the density plane – achieving flat wafer surface and uniform metal thickness in CMP processes
2010 · Hanno Melzner, Ning Cui, et al. · ASMC proceedings · 1
Time Dependent Anomalous Charge Loss Modeling in Flash Memories and an Accelerated Testing Procedure
2001 · Franz Schuler, Georg Tempel, et al. · International Conference on Solid State Devices and Materials (SSDM) · 1
Device and Method for Measuring Interface Strength in Microstructures
2021 · Hanno Melzner, Wieland Heyn, et al. · SSRN Electronic Journal
自動車応用のためのICレイアウトの臨界領域解析【Powered by NICT】
2016 · Joseph Ke Kian Seng, Heng Tan Ban, et al. · IEEE Conference Proceedings
Special Section on the Advanced Semiconductor Manufacturing Conference 2007 (ASMC 2007)
2008 · Oliver D. Patterson, Hanno Melzner, et al. · IEEE Transactions on Semiconductor Manufacturing
Works count: 22
Citation count: 77
H-index: 6
I10-index: 1
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