Author

K. Friedel

Observed names: K Friedel, K.P. Friedel, KP Friedel, Kazimierz Friedel, Kazimierz P Friedel

Institution: Wrocław University of Science and Technology

Observed institutions: Wrocław University of Science and Technology, University of Wrocław, EV Group (Austria)

OpenAlex ID: A5014031441

Electron beam activated brazing of cubic boron nitride to tungsten carbide cutting tools

2001 · Jan Felba, Kazimierz P Friedel, et al. · Vacuum · 26

Control of the electron beam active zone position in electron beam welding processes

2004 · Katarzyna Olszewska, Kazimierz Friedel · Vacuum · 21

Investigation of key technologies for System-in-Package integration of inertial MEMS

2009 · Norman Marenco, Wolfgang Reinert, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 16

A Procedure for Validating the Finite Element Model of a Piezoresistive Ceramic Pressure Sensor

2004 · M.S. Zarnik, D. Belavic, et al. · IEEE Transactions on Components and Packaging Technologies · 12

A systematic method for optimizing the electron beam hardening process

1996 · KP Friedel, J Felba, et al. · Vacuum · 11

TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads

2008 · Tomasz Fałat, Kazimierz Friedel, et al. · Microsystem Technologies · 10

Characterization and performance of electrically conductive adhesives for microwave applications

2002 · J. Felba, K.P. Friedel, et al. · International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing · 8

Numerical simulation and experimental verification of the piezoresistivity phenomenon for the printed thick-film piezoresistors

2004 · A. Wymyslowski, M. Santo-Zamik, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5

Numerical simulation and experimental verification of the thermal contact properties of the polymers bonds

2004 · A. Wymyslowski, T. Falat, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4

The influence of filler particle shapes on adhesive joints in microwave applications

2003 · J. Felba, K. Friedel, et al. · International Conference on Polymers and Adhesives in Microelectronics and Photonics · 4

The optimization of a triode electron gun with a thermionic cathode

1997 · J. Felba, K.P. Friedel, et al. · Applied Surface Science · 4

Application of glow discharge electron gun to surface modification

1990 · J. Felba, K. Friedel, et al. · Vacuum · 4

Management of waste electrical and electronic equipment in Poland - Ecological, organizing and economical aspects

2008 · Przemyslaw Matkowski, Kazimierz Friedel · International Students and Young Scientists workshop Photonics and Microsystems · 3

An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages

2004 · K. Friedel, A. Wymyslowski · Journal of Microelectronics and Electronic Packaging · 3

The influence of process parameters and materials properties on stress distribution in MEMS - ASIC integrated systems after molding - numerical and experimental approach

2009 · T. Falat, K. Friedel, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2

Electrical conduction of adhesive joints in microwave applications

2002 · J. Felba, K.P. Friedel · International Conference on Polymers and Adhesives in Microelectronics and Photonics · 2

Zaawansowane technologie w montażu aparatury elektronicznej

2002 · K. Friedel · Elektronika : konstrukcje, technologie, zastosowania · 1

Systematical error of the measurement of electron beam emittance

1998 · Stefan Wójcicki, Kazimierz Friedel · Vacuum · 1

A Numerical Study on Heat Flow and Load Distribution During Chip to Wafer or Wafer to Wafer Bonding in Vacuum

2008 · Krzysztof Malecki, Lukasz Pikur, et al. · IEEE Electronics Packaging Technology Conference (EPTC)

Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process

2008 · Krzysztof Małecki, Gernot Bock, et al.

Uproszczona ocena cyklu życia złączy wykonanych przy zastosowaniu bezołowiowych stopów lutowniczych oraz klejów elektrycznie przewodzących

2006 · K. Friedel, P. Matkowski, et al. · Prace Przemysłowego Instytutu Elektroniki

Bezołowiowe technologie montażu elementów elektronicznych na płytkach obwodów drukowanych

2005 · K. Friedel · Elektronika : konstrukcje, technologie, zastosowania

Postępowanie z zużytym sprzętem elektronicznym.

2005 · K. Friedel · Recykling

Recykling sprzętu elektronicznego.

2004 · K. Friedel · Recykling

Zastosowanie klejów w montażu aparatury elektronicznej

2001 · J. Felba, K. Friedel · Elektronika : konstrukcje, technologie, zastosowania

Works count: 29

Citation count: 137

H-index: 7

I10-index: 6