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Tae Yeob Kang
Observed names:
Kang Tae Yeob,
Kang, Tae Yeob
Institutions:
University of Suwon,
Ajou University
Observed institutions:
Korea Advanced Institute of Science and Technology,
University of Suwon,
Kongju National University,
Agency for Defense Development,
Ajou University
ORCID:
0000-0001-6043-1695
Observed ORCID:
0000-0001-6043-1695
OpenAlex ID:
A5016004176
The effect of inclination on impinging jets at small nozzle-to-plate spacing
2012
·
Kyosung Choo
, Tae Yeob Kang
, et al.
·
International Journal of Heat and Mass Transfer
·
42
Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis
2021
·
Tae Yeob Kang
, Donghwan Seo
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
13
Detection of Graphene Cracks By Electromagnetic Induction, Insensitive to Doping Level
2019
·
Taeshik Yoon
, Sumin Kang
, et al.
·
Computer Modeling in Engineering & Sciences
·
10
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain
2024
·
Tae Yeob Kang
, Haebom Lee
, et al.
·
Microelectronics Reliability
·
6
PDF
The effect of temperature on performance of a RF CMOS power amplifer and bond wires
2015
·
Tae Yeob Kang
, Donghwan Seo
·
6
Evaluation of Leakage Currents of Semiconductor Packages Due to High-Voltage Stress Under an Immersion Cooling Environment
2025
·
Kyuhae Min
, Taejun Kang
, et al.
·
Applied Sciences
·
3
PDF
Non-Invasive Quantification of Corrosion in Cu Interconnects Using Regression Models With S-Parameters
2025
·
Tae Yeob Kang
, Seunghyeok Hong
·
IEEE Access
·
3
The effect of temperature on performance of a RF CMOS power amplifer and bond wires
2016
·
Tae Yeob Kang
, Donghwan Seo
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
·
3
Early detection and instantaneous cause analysis of defects in interconnects by machine learning (ranking-CNN) of scattering parameter patterns
2019
·
Tae Yeob Kang
, Donghwan Seo
, et al.
·
IMAPSource Proceedings
·
2
An Empirical Study on Fault Detection and Root Cause Analysis of Indium Tin Oxide Electrodes by Processing S-Parameter Patterns
2024
·
Tae Yeob Kang
, Haebom Lee
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
1
PDF
Image Generation of Ultra-Thin Polymer Films Using Diffusion Models from Tensile Testing for Mechanical Failure Prediction
2024
·
Sungho Suh
, Haebom Lee
, et al.
·
International Conference on Electronics, Information, and Communication (ICEIC)
·
1
Fault Diagnosis of Indium Tin Oxide Electrodes by Multi-channel S-parameter Patterns
2024
·
Sungho Suh
, Haebom Lee
, et al.
·
International Conference on Electronics, Information, and Communication (ICEIC)
·
1
A Method of Reliability Demonstration Test Design For Missiles Stored in an Ammunition Igloo Without Maintenance
2019
·
Donghwan Seo
, Tae Yeob Kang
, et al.
·
Journal of Applied Reliability
·
1
Radio frequency response as a non-destructive readout associated with tensile-strength degradation in nanoporous carbon electrodes
2026
·
Yonghwi Kim
, Jae-Bum Pyo
, et al.
·
Scientific Reports
PDF
RF Data for "Radio Frequency Response as a Non-Destructive Readout Associated with Tensile-Strength Degradation in Nanoporous Carbon Electrodes"
2026
·
Kim, Yonghwi
, Pyo, Jae-Bum
, et al.
·
Zenodo (CERN European Organization for Nuclear Research)
Replication Data for: Non-destructive corrosion evaluation of electronic packages using AI regression with on-instrument Smith charts, boosted by an impedance-plane data augmentationce-plane data augmentation
2026
·
Namgyeong Kim
, Minkyu kang
, et al.
·
Figshare
Importance of Molecular Weight of Conjugated Polymer Thin Films on Thermomechanical Reliability of Stretchable Organic Semiconductors
2026
·
Dong Jun Kim
, Jin-Woo Lee
, et al.
·
Chemistry of Materials
Clustering-Enhanced Deep Surrogate Model for Global Stress and Weak-Point Detection in Semiconductor Packaging
2026
·
Boo Soo Ma
, Boyeon Kim
, et al.
Visualization of Corrosion in Electrodes Using a Conditional Diffusion Model Trained on S-Parameters
2026
·
Haebom Lee
, Tae Yeob Kang
Enhancement of Micro-DIC Technique and Deformation Measurement of Fine-Pitch Semiconductor Packages
2026
·
Hyunwoo Nam
, Seongkyu Choi
, et al.
Knowledge-guided strain-damage image correlation for diagnosing nonlinear mechanical behavior of freely stretched ultra-thin polymer films on water surface
2026
·
Myoung Song
, Seung Jin Oh
, et al.
·
Polymer Testing
Non-destructive AI-Based Crack Diagnosis of Surface-Mounted Devices with De-Embedded S-Parameter Patterns
2026
·
Minkyu Kang
, Namgyeong Kim
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
Non-Destructive Diagnosis of Cracks in SMD Capacitors Using Deep Learning on Impedance Spectra
2025
·
Minkyu Kang
, Namgyeong Kim
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
Non-Invasive Corrosion Quantification in Electronic Packages Using Smith Charts
2025
·
Tae Yeob Kang
, Namgyeong Kim
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
Deep Learning with De-Embedded S-Parameters for Assessing Crack Propagation in Solder Joints
2025
·
Namgyeong Kim
, Minkyu Kang
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
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Works count:
33
Citation count:
95
H-index:
5
I10-index:
3
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