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Tsung-Chieh Chiu
Observed name:
T.C. Chiu
Institution:
Industrial Technology Research Institute
Observed institutions:
Industrial Technology Research Institute,
Texas Instruments (United States),
National Cheng Kung University
ORCID:
0000-0001-9753-0750
Observed ORCID:
0000-0001-9753-0750
OpenAlex ID:
A5016151534
Amperometric detection of bilirubin from a micro-sensing electrode with a synthetic bilirubin imprinted poly(MAA-co-EGDMA) film
2006
·
Mei-Jywan Syu
, Tsung-Chieh Chiu
, et al.
·
Biosensors and Bioelectronics
·
47
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
2012
·
Wei-Yu Chen
, Tsung-Chieh Chiu
, et al.
·
Scripta Materialia
·
35
The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint
2009
·
Tsung-Chieh Chiu
, Kwang-Lung Lin
·
Scripta Materialia
·
32
Binding specificity of α-bilirubin-imprinted poly(methacrylic acid-co-ethylene glycol dimethylacrylate) toward α-bilirubin
2004
·
Mei-Jywan Syu
, Jing-Hong Deng
, et al.
·
Biomaterials
·
29
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
2012
·
Wei-Yu Chen
, Tsung-Chieh Chiu
, et al.
·
Intermetallics
·
26
The difference in the types of intermetallic compound formed between the cathode and anode of an Sn–Ag–Cu solder joint under current stressing
2009
·
Tsung-Chieh Chiu
, Kwang-Lung Lin
·
Intermetallics
·
25
Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps
2017
·
Chiao-Wen Chen
, Tsung-Chieh Chiu
, et al.
·
Intermetallics
·
20
Carbon nanotube buckypaper/MmNi5 composite film as anode for Ni/MH batteries
2011
·
P.J. Tsai
, T.C. Chiu
, et al.
·
International Journal of Hydrogen Energy
·
13
Electro-dissolution of the Bi second phase in Sn5Bi solder alloy
2015
·
Tsung-Chieh Chiu
, Ying-Ta Chiu
, et al.
·
Materials Letters
·
11
The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing
2011
·
Tsung-Chieh Chiu
, Kwang-Lung Lin
·
Intermetallics
·
11
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
2008
·
Tsung-Chieh Chiu
, Kwang-Lung Lin
·
Journal of materials research/Pratt's guide to venture capital sources
·
10
Solder interconnection specimen design and test control procedure for vaild constitutive modeling of solder alloys
2006
·
D. Bhate
, D. Chan
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
8
The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test
2012
·
Fu-Jung Yeh
, Tsung-Chieh Chiu
, et al.
·
International Conference on Electronic Materials and Packaging
·
7
Current induced rapid phase transformation in Au/Sn reaction couple
2017
·
Tsung-Chieh Chiu
, Kwang-Lung Lin
·
Journal of Alloys and Compounds
·
6
Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate
2011
·
Wei-Luen Jang
, Tsung-Chieh Chiu
, et al.
·
Thin Solid Films
·
6
Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing
2018
·
Chen-Yi Lin
, Tsung-Chieh Chiu
, et al.
·
Journal of Applied Physics
·
5
Softening of Micro Sn Electrodeposit by Polyethylene Glycol (PEG) Addition
2018
·
Tsung-Chieh Chiu
, Ying-Ta Chiu
, et al.
·
ECS Journal of Solid State Science and Technology
·
1
PDF
Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocrystalline Cu/SiO2 Chip-on-Wafer Hybrid Bonding for 3D Chip Integration
2024
·
Ang-Ying Lin
, Yu-Min Lin
, et al.
·
International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
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Works count:
18
Citation count:
292
H-index:
10
I10-index:
11
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