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Author

Gwang Kim

Observed name: Gwang. Kim
Institution: Chosun University
ORCID: 0000-0002-1655-1013
Observed ORCID: 0000-0002-1655-1013
OpenAlex ID: A5016694872
Reliable design of container shipping network with foldable container facility disruption
2022 · Yoonjea Jeong, Gwang Kim · Transportation Research Part E Logistics and Transportation Review · 28
Electromigration for advanced Cu interconnect and the challenges with reduced pitch bumps
2014 · Nokibul Islam, Gwang Kim, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19
Reliable container supply chain under disruption
2022 · Yoonjea Jeong, Gwang Kim, et al. · Annals of Operations Research · 15
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Investigation of integrated passive device with through-silicon via
2012 · Kai Liu, Robert Frye, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
Robust closed-loop supply chain model with return management system for circular economy
2025 · Youngchul Shin, Gwang Kim, et al. · Computers & Industrial Engineering · 12
A mobile multi-agent sensing problem with submodular functions under a partition matroid
2021 · Jongmin Lee, Gwang Kim, et al. · Computers & Operations Research · 12
Transient thermal characterization of a fcBGA-H device
2013 · E. Ouyang, B. Ahn, et al. · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 8
Simulation and Experiment of Molded Underfill Voids
2012 · MyoungSu Chae, Eric Ouyang, et al. · IMAPSource Proceedings · 6
Online advertising assignment problem without free disposal
2020 · Gwang Kim, Ilkyeong Moon · Applied Soft Computing · 5
Same access, different uses, and the persistent digital divide between urban and rural users
2015 · Sora Park, Gwang Kim · University of Canberra Research Portal · 5
An exact solution approach for the mobile multi‐agent sensing problem
2022 · Gwang Kim, Jongmin Lee, et al. · International Journal of Robust and Nonlinear Control · 4
Analysis of Architectural Complexity for Product Family and Platform
2016 · Gwang Kim, Yunjung Kwon, et al. · ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE) · 4
High-speed packages with imperfect power and ground planes
2013 · Kai Liu, Robert Frye, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
High rejection low-pass-filter design using integrated passive device technology for Chip-Scale Module Package
2010 · YongTaek Lee, Kai Liu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Next-day demand based last-mile delivery route optimization with collection of reusable bags
2025 · Sangjun Yoon, Gwang Kim, et al. · Transportation Research Part E Logistics and Transportation Review · 3
Uncertain demurrage and detention decisions in hinterland container management
2025 · Yoonjea Jeong, Gwang Kim, et al. · International Transactions in Operational Research · 3
A Study on the Electrical Characteristics of Different Wire Materials
2013 · Chi-Hyeon Jeong, Billy Ahn, et al. · Journal of the Microelectronics and Packaging Society · 3
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Impact of Copper Densities of Substrate Layers on the Warpage of IC Packages
2013 · SeonMo Gu, Billy Ahn, et al. · Journal of the Microelectronics and Packaging Society · 3
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An efficient algorithm for multi-modal skyport location problem with choice-based demand
2025 · Gwang Kim, Yoonjea Jeong, et al. · Socio-Economic Planning Sciences · 2
Electrical-thermal characterization of wires in packages
2014 · Kai Liu, Robert Frye, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Comparisons of Interfacial Reaction Characteristics on Flip Chip Package with Cu Column BOL Enhanced Process (fcCuBE®) and Bond on Capture Pad (BOC) under Electrical Current Stressing
2013 · Jae Myeong Kim, Billy Ahn, et al. · Journal of the Microelectronics and Packaging Society · 2
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Thermal Characterization and Simulation of a fcBGA-H device
2012 · Eric Ouyang, Weikun He, et al. · IMAPSource Proceedings · 2
New mathematical formulation for idle OHT vehicle repositioning: maximization of repositioning success probability
2025 · Youngchul Shin, Yoonjea Jeong, et al. · Engineering Optimization · 1
An approximation algorithm for mobile multi-agent monitoring and routing problem
2025 · Gwang Kim, Yoonjea Jeong · Flexible Services and Manufacturing Journal · 1
Electrical Performance Comparison between fcBGA and eWLB Packages
2014 · Kai Liu, YongTaek Lee, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Works count: 37
Citation count: 166
H-index: 7
I10-index: 6
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