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Byoung-Joon Kim
Institution:
Tech University of Korea
Observed institution:
Tech University of Korea
ORCID:
0009-0005-0455-8583
Observed ORCID:
0009-0005-0455-8583
OpenAlex ID:
A5016821780
Assessing the Role of Yarn Placement in Plated Knit Strain Sensors: A Detailed Study of Their Electromechanical Properties and Applicability in Bending Cycle Monitoring
2024
·
Youn-Hee Kim
, Juwon Jun
, et al.
·
Sensors
·
9
PDF
Interdiffusion Behavior and Microstructure Change of Al-, Ti-, or Ta-doped NiCoCrAlY Bond Coat on IN 792 Superalloy
2025
·
Yeon Woo Yoo
, Dongwon Kim
, et al.
·
Metals and Materials International
·
2
Mechanical Reliability of Cu Electrode for Flexible Electronics under Asymmetric Bending Deformations
2024
·
Dong-Chul Shin
, Geum-Yong Park
, et al.
·
Journal of Flexible and Printed Electronics
·
2
PDF
Reliability study on rolling deformation of ITO thin film on flexible substrate
2018
·
Jae-Geun Seol
, Dongjun Lee
, et al.
·
Journal of the Microelectronics and Packaging Society
·
2
Improving bending fatigue lifetime and interfacial adhesion of Cu–Mn flexible interconnects using self-forming nanolayer
2026
·
Seongi Lee
, Jae-Myeong Shin
, et al.
·
Nanotechnology Reviews
Cuag Alloy-Driven Low-Temperature Bonding for Advanced 3d Packaging
2025
·
Ju-Won Jun
, Seng-Hyuk Lee
, et al.
·
SSRN Electronic Journal
Electrical Reliability of ITO Film on Flexible Substrate During bending Deformations and Bending Fatigue
2017
·
Jea-Geun Seol
, Byoung-Joon Kim
·
Journal of the Microelectronics and Packaging Society
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Works count:
7
Citation count:
15
H-index:
2
I10-index:
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