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Yener Usul
Observed name:
Usul, Yener
Institution:
Roketsan
Observed institution:
Roketsan
ORCID:
0000-0002-1087-4743
Observed ORCID:
0000-0002-1087-4743
OpenAlex ID:
A5017139608
Validation of a Finite Element Thermal Analysis Model of a Simple Electronics Board
2019
·
Yener Usul
, Bulent Acar
, et al.
·
International Conference on Recent Advances in Space Technologies
·
1
Kapalı hacim ı̇çerisı̇ndekı̇ bir elektronı̇k kartın hesaplamalı akışkanlar dinamiği, ı̇letim-tabanlı sonlu elemanlar ve deneysel yöntemlerle parametrı̇k olarak termal açıdan ı̇ncelenmesi
2025
·
Yener Usul
, Şenol Başkaya
, et al.
·
Gazi Üniversitesi Mühendislik-Mimarlık Fakültesi Dergisi
PDF
Parametric thermal investigation of an electronic board in an enclosure by computational fluid dynamics, conduction-based finite element and experimental methods
2025
·
Usul, Yener
, Başkaya, Şenol
, et al.
·
DergiPark (Istanbul University)
A Model Reduction Method for Conduction-Based Thermal Analysis of a Complex System to Obtain an Equivalent Numerical Model
2024
·
Yener Usul
, Emir Özkökdemir
·
ASME Heat Transfer Summer Conference (HT)
Investigations on Thermal Performance of an Electronic Board Using Conduction-based Finite Element Method With a New Modeling Approach
2022
·
Yener Usul
, Şenol Başkaya
, et al.
·
Isı Bilimi ve Tekniği Dergisi
PDF
Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types
2021
·
Emir Ozkokdemir
, Yener Usul
Determination of the Thermal Properties of a PCB by Coupled Numerical and Experimental Approach
2021
·
Yener Usul
, Mustafa \xd6z\xe7atalba\u015f
A Novel Fast Predicting Technique for the Absorptivity of Surface Coating
2021
·
Emir Özkökdemir
, Berkay Filiz
, et al.
·
ASME Heat Transfer Summer Conference (HT)
Determination of the Thermal Properties of a PCB by Coupled Numerical and Experimental Approach
2020
·
Yener Usul
, Mustafa Özçatalbaş
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
Investigation on Thermal Performance of a Simple Electronic Board Using Different Phase Change Material Packaging Types
2020
·
Emir Özkökdemir
, Yener Usul
·
ASME International Mechanical Engineering Congress and Exposition (IMECE)
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Works count:
10
Citation count:
1
H-index:
1
I10-index:
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