Author

Bart Baudemprez

Observed name: B. Baudemprez

Institution: IMEC

Observed institution: IMEC

OpenAlex ID: A5017524015

2007 · Anne Marie Goethals, Rik Jonckheere, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 27

Experimental validation of full-field extreme ultraviolet lithography flare and shadowing corrections

2008 · A. M. Myers, G. F. Lorusso, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 20

Imaging performance of the EUV alpha semo tool at IMEC

2008 · G. F. Lorusso, J. Hermans, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 16

Process window discovery methodology development for advanced lithography

2016 · Dieter Van den Heuvel, Philippe Foubert, et al. · ASMC proceedings · 15

Demonstration of scaled 0.099µm2 FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology

2009 · A. Veloso, S. Demuynck, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 15

SEM based overlay measurement between resist and buried patterns

2016 · Osamu Inoue, Yutaka Okagawa, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 13

Effective EUVL mask cleaning technology solutions for mask manufacturing and in-fab mask maintenance

2011 · Uwe Dietze, Peter Dress, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12

Dependence of EUV mask printing performance on blank architecture

2008 · Rik Jonckheere, Yoonsuk Hyun, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12

Stability and imaging of the ASML EUV alpha demo tool

2009 · Jan V. Hermans, Bart Baudemprez, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11

Further investigation of EUV process sensitivities for wafer track processing

2010 · Neil Bradon, K. Nafus, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10

Towards reduced impact of EUV mask defectivity on wafer

2014 · R. Jonckheere, D. Van den Heuvel, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9

Full-field EUV and immersion lithography integration in 0.186μm2 FinFET 6T-SRAM cell

2008 · A. Veloso, S. Demuynck, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 9

In-line lithography cluster monitoring and control using integrated scatterometry

2004 · Ivan Pollentier, Shaunee Y. Cheng, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9

Detection of bonding voids for 3D integration

2023 · Cong Chen, Dieter Van Den Heuvel, et al. · Metrology, Inspection, and Process Control XXXVI · 8

Investigation of the performance of state-of-the-art defect inspection tools within EUV lithography

2012 · Dieter Van den Heuvel, Rik Jonckheere, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8

Optimization toward non-zero offset stability in overlay control: trends and prospects

2025 · Nadav Gutman, Bart Baudemprez, et al. · Metrology, Inspection, and Process Control XXXVI · 6

Full field EUV lithography: lessons learned on EUV ADT imaging, EUV resist and EUV reticles

2008 · E. Hendrickx, A. M. Goethals, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Full field EUV lithography turning into a reality at IMEC

2007 · Rik Jonckheere, Gian Francesco Lorusso, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Overlay metrology solutions in a triple patterning scheme

2015 · Philippe Leray, Ming Mao, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5

Hybrid overlay metrology for high order correction by using CDSEM

2016 · Philippe Leray, Sandip Halder, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4

Integrated cleaning and handling automation of NXE3100 reticles

2012 · Rik Jonckheere, Tobias Waehler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Extreme UV self-aligned double patterning process optimization for BEOL interconnections on 3nm nodes and beyond

2024 · Daniel Montero Alvarez, Nunzio Buccheri, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 2

Impact of stochastic process variations on overlay mark fidelity "towards the 5nm node"

2017 · Michael Adel, Roel Gronheid, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2

Influence of wafer topography on focus control and defectivity in EUV lithography

2025 · Roel Gronheid, Huan Ren, et al. · SPIE Optical and EUV Nanolithography · 1

Multivariate analysis of a 100-nm process measured by in-line scatterometry

2004 · Sebastien Egret, Tetsunari Furusho, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Works count: 25

Citation count: 229

H-index: 10

I10-index: 10