Author

Guangbin Dou

Observed names: Dou, Guangbin, G. B. Dou, G. Dou, G.B. Dou, Guangbin Dou (7201856)
ORCID: 0000-0001-8793-3441
Observed ORCID: 0000-0001-8793-3441
OpenAlex ID: A5018081197
2021 · Nan Wu, Shu Wan, et al. · InfoMat · 96
2014 · W. T. Pike, A. K. Delahunty, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 39
2003 · G. B. Dou, Y. C. Chan, et al. · Journal of Electronic Packaging · 33
2024 · Jingli Liu, Chenhui Xia, et al. · Advanced Engineering Materials · 19
2024 · Yide Dong, Yike Zhou, et al. · Nanotechnology and Precision Engineering · 19
2016 · Huafeng Liu, W. T. Pike, et al. · Journal of Applied Physics · 18
2021 · Haizhou Huang, Nan Wu, et al. · Advanced Materials Interfaces · 17
2014 · Huafeng Liu, W.T. Pike, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 14
2008 · Guangbin Dou, David C. Whalley, et al. · Applied Physics Letters · 14
2010 · Guangbin Dou, David C. Whalley, et al. · Soldering and Surface Mount Technology · 12
2006 · Guangbin Dou, D.C. Whalley, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
2008 · Guangbin Dou, D.P. Webb, et al. · Electronic System-Integration Technology Conference (ESTC) · 10
2023 · Meng Nie, Pengfan Chen, et al. · Advanced Intelligent Systems · 9
2010 · A. Bansal, R. Hergert, et al. · Microelectronic Engineering · 9
2025 · Fangmeng Xu, Chunyan Yin, et al. · Materials Science in Semiconductor Processing · 7
2022 · Meng Nie, Lei Wen, et al. · Macromolecular Materials and Engineering · 6
2006 · Guangbin Dou, David Whalley, et al. · International Conference on Electronic Materials and Packaging · 6
2006 · G. Dou, Y.C. Chan, et al. · Soldering and Surface Mount Technology · 6
2005 · Guangbin Dou, D.C. Whalley, et al. · International Symposium on High Density packaging and Microsystem Integration · 6
2021 · Meng Nie, Lei Wen, et al. · Macromolecular Materials and Engineering · 5
Works count: 74
Citation count: 582
H-index: 13
I10-index: 17
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