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Ruben Kahle

Large area compression molding for Fan-out Panel Level Packing
2015 · T. Braun, S. Raatz, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 80
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
2019 · Tanja Braun, Karl-Friedrich Becker, et al. · Micromachines · 59
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From wafer level to panel level mold embedding
2013 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 45
Panel Level Packaging - A View Along the Process Chain
2018 · Tanja Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 43
Through mold vias for stacking of mold embedded packages
2011 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 41
Large area embedding for heterogeneous system integration
2010 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 25
24"×18" Fan-out panel level packing
2014 · T. Braun, K.-F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
Panel Level Packaging – Where are the Technology Limits?
2022 · Tanja Braun, Ole Holck, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23
Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
2019 · Tanja Braun, Karl-Friedrich Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 23
Fan-out wafer level packaging for 5G and mm-Wave applications
2018 · T. Braun, K.-F. Becker, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 23
Through mold via technology for multi-sensor stacking
2012 · T. Braun, M. Brundel, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 22
A compact W-band LFMCW radar module with high accuracy and integrated signal processing
2015 · Christian Zech, Axel Hulsmann, et al. · European Microwave Conference (EuMC) · 21
Challenges and opportunities for Fan-out Panel Level Packing (FOPLP)
2014 · T. Braun, K.-F. Becker, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 21
pH sensors based on amino-terminated carbon nanomembrane and single-layer graphene van der Waals heterostructures
2021 · D. Kaiser, Z. Tang, et al. · Applied Physics Reviews · 18
From fan-out wafer to fan-out panel level packaging
2015 · T. Braun, K.-F. Becker, et al. · European Conference on Circuit Theory and Design · 18
Potential and challenges of fan-out panel level packaging
2016 · Tanja Braun, Karl-Friedrich Becker, et al. · IEEE CPMT Symposium Japan (ICSJ) · 14
Foldable Fan-Out Wafer Level Packaging
2016 · T. Braun, K. -F. Becker, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
Process Modules for High-Density Interconnects in Panel-Level Packaging
2019 · Friedrich-Leonhard Schein, Ruben Kahle, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 12
3D stacking approaches for mold embedded packages
2011 · T. Braun, K.-F. Becker, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 11
Fan-out Wafer Level Packaging for MEMS and Sensor Applications
2014 · T. Braun, Karl‐Friedrich Becker, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 7
Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond
2022 · Friedrich-Leonhard Schein, Christian Voigt, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
2018 · Patrick Reinecke, Marie-Theres Putze, et al. · IMAPSource Proceedings · 4
Biocompatible Lab-On-Substrate technology platform
2009 · T. Braun, L. Bottcher, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Embedding technologies for an automotive radar system
2009 · K.-F. Becker, M. Koch, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
High Density RDL Technologies for Panel Level Packaging of Embedded Dies
2021 · Lars Boettcher, S. Kosmider, et al. · Journal of Surface Mount Technology · 3
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Works count: 47
Citation count: 585
H-index: 15
I10-index: 19
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