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Simon Kuttler

Observed name: S. Kuttler
ORCID: 0009-0005-0685-6103
Observed ORCID: 0009-0005-0685-6103
OpenAlex ID: A5019263793
Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters
2021 · C. Rudolph, A. Hanisch, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 26
Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation
2020 · E. Kolbinger, S. Kuttler, et al. · Microelectronics Reliability · 16
Simulation challenges of warpage for wafer- and panel level packaging
2020 · Marius van Dijk, Simon Kuttler, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13
Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
2021 · Seyyid Dilek, Ivan Ndip, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 8
Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
2018 · Arian Grams, Simon Kuttler, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Numerical Simulation of a Wire Bond Shear Test Using Nonlinear Adaptive Remeshing
2022 · Simon Kuttler, Olaf Wittler, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Thermal Management of a Ka Band Satellite Communication Module Using Finite Element Models and Thermal Imaging
2018 · Arian Grams, Brian Curran, et al. · International Workshop on Thermal Investigations of ICs and Systems · 3
Behavior of Different Ultrasonically Bonded Aluminum Heavy Wires in the Shear Test
2024 · Simon Kuttler, Olaf Wittler, et al. · Journal of Electronic Materials · 2
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Determination of Stress-Strain Properties Combining Small-Depth Nanoindentation and Numerical Simulation
2018 · S. Kuttler, H. Walter, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Reduced-Order Modeling for Efficient Reliability Assessment of Package–Board Interactions
2025 · Chengdong Yuan, Sönke Maeter, et al. · Journal of Electronic Packaging · 1
Determination of Lemaitre Damage Parameters for Al H11 Wire Material
2023 · Simon Kuttler, Bilen Emek Abali, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Reverse Engineering of QFN Epoxy Mold Compound Properties using Digital Image Correlation
2026 · Simon Kuttler, Marius Van Dijk, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Reverse Engineering of Thermomechanical Properties for Materials in Microelectronic Packaging
2025 · Simon Kuttler, Sükrücan Mutlu, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Determination of the Thermo-Oxidative Ageing Depth and its Influence on Mechanical Properties in (Highly) Filled Polymers
2025 · Marius Van Dijk, Simon Kuttler, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Reduced-Order Modelling for Efficient Chip-Package-Board Design
2025 · Chengdong Yuan, Sönke Maeter, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Investigation of the Influence of Shear Height in the Wire Bond Shear Test
2024 · Simon Kuttler, Olaf Wittler, et al. · Electronic System-Integration Technology Conference (ESTC)
Works count: 16
Citation count: 79
H-index: 4
I10-index: 3
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