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Florent Dettoni

Nanoscale template for the growth of one-dimensional nanostructures
2011 · F. Dettoni, H. Sahaf, et al. · Europhysics Letters (EPL) · 13
(Invited) Hybrid Bonding for 3D Applications: Improvements and Limitations
2023 · Emilie Deloffre, Bassel Ayoub, et al. · ECS Transactions · 11
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Target design optimization for overlay scatterometry to improve on-product overlay
2015 · Henk-Jan H. Smilde, Richard J. F. van Haren, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11
High resolution nanotopography characterization at die scale of 28nm FDSOI CMOS front-end CMP processes
2013 · F. Dettoni, M. Rivoire, et al. · Microelectronic Engineering · 11
Study of µDBO overlay target size reduction for application broadening
2018 · Victor Calado, Jerome Depre, et al. · Metrology, Inspection, and Process Control XXXVI · 8
Enhanced 28nm FD-SOI diffraction based overlay metrology based on holistic metrology qualification
2017 · Florent Dettoni, Régis Bouyssou, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8
Nanoscale Si template for the growth of self-organized one-dimensional nanostructures
2012 · Laurence Masson, Houda Sahaf, et al. · Applied Surface Science · 8
Image based overlay measurement improvements of 28nm FD-SOI CMOS front-end critical steps
2017 · F. Dettoni, T. Shapoval, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
Self‐assembled Si nanostripe grating at the molecular scale as a template for 1D growth
2010 · H. Sahaf, F. Dettoni, et al. · Surface and Interface Analysis · 7
Advanced overlay metrology for CIS bonding applications
2023 · Florent Dettoni, Emilie Deloffre, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
A proof of concept of remote contour-based SEM metrology integration in HVM environment
2022 · Bertrand Le-Gratiet, Régis Bouyssou, et al. · Metrology, Inspection, and Process Control XXXVI · 5
Scatterometry-based metrology for the 14nm node double patterning lithography
2015 · D. Carau, R. Bouyssou, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
The image lab sandbox, pulling image computing in wafer fab metrology environment
2023 · Florent Dettoni, Bertrand Le-Gratiet · European Mask and Lithography Conference (EMLC) · 2
Accelerating process robustness consolidation with massive beam inspection and CD SEM contour-analysis
2024 · NICOLAS LESIRE, Bertrand Le-Gratiet, et al. · European Mask and Lithography Conference (EMLC) · 1
Image sharpness score CD-SEM CDSEM monitoring
2023 · Nicolas KUBLER, Bertrand Le-Gratiet, et al. · European Mask and Lithography Conference (EMLC) · 1
Robust and automated methodology for scanner matching using contour-based analysis
2023 · Jean Gabriel Simiz, Romain Alestra, et al. · SPIE Optical and EUV Nanolithography · 1
Mitigating gain, effort and cost for EOW overlay control
2020 · Olivier Mermet, Maxime Gatefait, et al. · Metrology, Inspection, and Process Control XXXVI · 1
64nm pitch metal1 double patterning metrology: CD and OVL control by SEMCD, image based overlay and diffraction based overlay
2015 · Julien Ducoté, Florent Dettoni, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Immersion lithography process tuning for line edge roughness optimization: photonic waveguides applications
2026 · Rita Chidoub, Aurélie Le Pennec, et al. · European Mask and Lithography Conference (EMLC)
A MetroSpection use case: enabling CNN ADC on CDSEM images for robust R&D developments and improved manufacturing quality control
2025 · Florent Dettoni, Bertrand Le-Gratiet, et al. · European Mask and Lithography Conference (EMLC)
Define a measurement standard to monitor local variabilities of immersion lithography baseline for photonic devices
2025 · Rita Chidoub, Aurélie Le Pennec, et al. · Metrology, Inspection, and Process Control XXXVI
(Invited) Hybrid Bonding for 3D Applications: Improvements and Limitations
2023 · Emilie Deloffre, Bassel Ayoub, et al. · ECS Meeting Abstracts
Scanning Acoustic Microscopy versus Colored Picosecond Acoustics to detect interface defects in hybrid wafer bonding
2020 · Bossut, Solene, Devos, Arnaud, et al. · HAL
Development of spatially resolved metrology processes of nano-topography over centimetric distances (application to chemical mechanical polishing)
2013 · DETTONI, Florent, BERTIN, François · theses.fr (ABES)
Interferometry: a direct die level characterization technique
2012 · Florent Dettoni, C. Beitia, et al.
Works count: 26
Citation count: 107
H-index: 7
I10-index: 4
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