Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
P. Choudhary
Institutions:
Intel (United States),
Auburn University
Observed institutions:
Intel (United States),
Auburn University
ORCID:
0000-0001-8659-2921
Observed ORCID:
0000-0001-8659-2921
OpenAlex ID:
A5019916620
Health Monitoring for Damage Initiation & Progression during Mechanical Shock in Electronic Assemblies
2006
·
P. Lall
, P. Choudhary
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
89
Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
2005
·
P. Lall
, D. Panchagade
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
84
Solder-Joint Reliability in Electronics under Shock and Vibration using Explicit Finite Element Sub-Modeling
2006
·
P. Lall
, S. Gupte
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
55
Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments
2009
·
P. Lall
, N. Islam
, et al.
·
IEEE Transactions on Components and Packaging Technologies
·
12
Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics
2009
·
P. Lall
, S. Gupte
, et al.
·
IEEE Transactions on Components and Packaging Technologies
·
10
Show more works
View as search
Works count:
5
Citation count:
250
H-index:
5
I10-index:
5
Year
Topic
Type
